ERS Launches Automated Panel Packaging System
The fully automated platform handles temporary carrier bonding, debonding, and detaping for 310×310 mm substrates in a single system.
Updated on Nov. 12, 2026 in Semiconductors
ERS electronic has announced a fully automated panel-level packaging system for 310×310 mm substrates, and the first unit has been delivered to a leading semiconductor manufacturer for its panel production line. The machine integrates temporary carrier bonding, debonding, and detaping into one platform.
Why it matters
Splitting bonding and debonding across separate machines adds handling steps, transit time, and risk of substrate damage. Consolidating these steps on one platform aims to streamline panel-level packaging production.
The machine processes 13 panels per hour on 310 mm × 310 mm substrates, which the manufacturer says improves area utilisation over 300 mm circular wafers. Throughput and yield figures have not been independently verified at the customer's production line.
The players
ERS electronic
A German equipment maker with 55 years of thermal management expertise and more than 30 years of in-house machine-building capability, which has supplied panel-level packaging tools since 2018.
Fraunhofer IZM
A Berlin-based research institute of the Fraunhofer Society focused on microelectronics and system integration, which received ERS's first commercial panel-level tool in 2018.
The details
The system moves panels between process modules rather than between separate machines, consolidating all three steps within one platform. It is developed and manufactured at ERS's Advanced Packaging facility in Barbing, Germany.
Timeline
2018: ERS shipped its first commercial panel-level tool to Fraunhofer IZM in Berlin.
2024: ERS integrated a semiconductor specialist equipment engineering team.
November 12, 2026: ERS announced the fully automated panel-level packaging system.
Roadmap
Yole Group projects the panel-level packaging segment to grow at a compound annual growth rate of over 40% over the next five years. ERS's automated system enters that segment as chipmakers look for larger substrate formats and fewer handling steps.
The consolidated platform may reduce the number of machines and handling steps that chip packaging lines require, which could affect production scheduling for manufacturers adopting it. Consumer-facing effects would depend on whether these throughput gains translate into lower-cost or more available chips over time.
The takeaway
Panel-level packaging is moving toward larger substrates and integrated process platforms, a shift that reduces handling between machines. Watch for independent throughput and yield results as customers bring these systems into production.
Further reading
For broader context on chip manufacturing equipment, explore more Semiconductors coverage.
Source note: This article includes information reported by Elektronikpraxis.
