VON ARDENNE Expands Into Panel-Level Packaging
The vacuum coating equipment maker is bringing its HiPIMS deposition technology to larger panel formats for semiconductor packaging.
Updated on Nov. 4, 2026 in Semiconductors
VON ARDENNE has added a HiPIMS solution for panel-level packaging to its semiconductor deposition portfolio, running on its HISS modular horizontal coating platform. The move extends the process from 300mm wafers to larger panel formats.
Why it matters
Panel-level packaging is a growing segment, with Yole Group reporting more than $300M in 2025 revenue. Moving deposition processes to larger panels is a route for equipment suppliers to serve that market.
HiPIMS deposits high-aspect-ratio barrier and seed layers in through-glass via holes on the HISS platform. Yole Group's projections cover revenue growth, but the source does not give throughput or yield specifications for the panel process.
The players
VON ARDENNE
A global leader in high-precision vacuum coating equipment that supplies deposition systems to the semiconductor and display industries.
Yole Group
A market research and consulting firm that publishes analyses of semiconductor packaging and advanced manufacturing markets.
TSMC
The Taiwan Semiconductor Manufacturing Company, the world's largest contract chipmaker, which has entered the panel-level packaging market.
The details
The HiPIMS solution deposits high-aspect-ratio barrier and seed layers in through-glass via holes, running on VON ARDENNE's HISS modular horizontal coating platform. The company is scaling the process from wafer-level production to panel-level manufacturing.
Timeline
2025: Panel-level packaging generated more than $300M in revenue, according to Yole Group.
March 2026: Yole published its "Panel Level Packaging 2026" report covering the market outlook.
2029-2030: Yole expects a period of strong PLP acceleration.
The Tech Race
Panel-level packaging is moving deposition work from 300mm wafers to larger panel formats, a shift that equipment makers like VON ARDENNE are adapting their platforms to serve. TSMC's entry into the panel market signals that the largest chipmakers are also competing for this segment.
The HiPIMS panel process is aimed at equipment buyers and chip packagers rather than consumers. Its effect on device prices or availability is not addressed in the source.
The takeaway
Panel-level packaging is becoming a larger market, and equipment suppliers are adapting proven wafer processes to meet it. Readers following semiconductor supply chains should watch how fast panel adoption moves toward the 2029-2030 window.
Further reading
For related coverage of chip manufacturing equipment, see the Semiconductors section.
Source note: This article includes information reported by DQ.
