The program provides Eswatini students with specialized tools to cultivate local semiconductor expertise.
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October 7, 2026
AM-Platform Has Joined Addliance as Core MemberThe European additive manufacturing group joined the industry hub to unify regional production efforts.
October 7, 2026
Researchers Developed New Chip Cooling SystemA new microfluidic manifold allows dielectric fluids to safely cool high-performance semiconductors.
October 7, 2026
Researchers Developed New Cryogenic Transistor ModelThe CryoModel-4K improves accuracy for semiconductor performance at 4 Kelvin temperatures.
October 7, 2026
RECOM Has Released RACM3000-M Power SuppliesThe new series of AC/DC power supply units delivers up to 3000W of output power for demanding industrial and medical systems.
October 7, 2026
BOS Semiconductors Joined MIRISE Chiplet ProjectThe partnership focuses on developing advanced interconnect technologies for future automotive systems.
October 7, 2026
CEMTEC and Eirich Formed Grinding PartnershipThe two engineering firms have combined their complementary milling technologies to serve the global mining sector.
October 7, 2026
Hamamatsu Photonics Released iPHEMOS-DDX MicroscopeThe new system integrates seven advanced failure analysis techniques to support modern AI chiplet architecture.
October 7, 2026
Rambus Launched Caliptra-Compatible Security SolutionThe new CryptoManager Root of Trust provides advanced security features for open-source hardware designs.
October 6, 2026
Intelligent Memory Signed Global Distribution PartnershipSourceability has added a suite of industrial memory products to its global franchise line.
October 6, 2026
Researchers Have Unveiled Terracotta DRAM FrameworkA new framework aims to simplify memory hardware updates via flexible controller designs.
