
Nordic Semiconductor Adds Long-Range Sub-GHz Connectivity
The company is extending its wireless chip-to-cloud portfolio with license-exempt Sub-GHz radio bands for wide-area coverage.
This section covers semiconductors — chip design, manufacturing capacity, supply chain conditions, export restrictions and the company and government decisions that determine where chips are made and who can buy them. Coverage spans the technology, the industry economics and the geopolitical competition that now shapes both.

The company is extending its wireless chip-to-cloud portfolio with license-exempt Sub-GHz radio bands for wide-area coverage.
November 9, 2026
NSING Tops 250 Million Bluetooth Chips ShippedNSING Technologies reports its Bluetooth products built on Ceva-Waves Bluetooth LE IP have passed 250 million units shipped.
November 9, 2026
Chipmakers Seek Shared Charging Standard for Fab RobotsSamsung Electronics, SK hynix, and Micron are working toward one common rulebook for the batteries and chargers used by mobile fabrication robots.
November 8, 2026
Living Neurons Drive Robot Dog in Lab TestAustralian firm Cortical Labs used lab-grown brain cells on a chip to steer a robotic dog toward a point on a simple map.
November 8, 2026
IEEE IEDM 2026 to Convene in San FranciscoThe 72nd annual IEEE International Electron Devices Meeting will run December 12-16, 2026, at the Hilton San Francisco Union Square.
November 8, 2026
AMD Acknowledges Radeon Driver SSD Write BugAMD has acknowledged a Radeon driver issue that causes continuous background writes to system SSDs on Windows systems.
November 8, 2026
Ripple Plans Major XRP Ledger Upgrades for 2027Ripple's engineering director outlined the company's performance and feature roadmap for the XRP Ledger in 2027.
November 8, 2026
Linux 7.5 Adds Rockchip RK3568 and AIE4 SupportKernel feature patches bring new display panel support and AMD NPU improvements to the Linux 7.5 development cycle.
November 8, 2026
Diamond Foundry Grows 200mm Single-Crystal DiamondThe company revealed a continuous diamond disc matching the 200mm silicon wafer size used in many power and analog chips.
November 8, 2026
XRP Ledger Upgrade Cuts Validator Memory UseTwo Ripple-operated validators recorded lower process memory after moving from xrpld 3.2.0 to 3.3.0, with heap trimming enabled.
November 8, 2026
JNTC Starts Paid Glass Substrate Samples for NVIDIAKorean firm JNTC has begun supplying paid through-glass-via substrate samples to NVIDIA as glass packaging gains interest for larger AI chips.
Coverage takes in chip architecture announcements, fabrication plant investments and construction timelines, supply chain bottlenecks and their resolution, export control rules and their enforcement, company earnings and the geopolitical competition over semiconductor manufacturing capacity. Fabrication plant announcements have become major economic and political events, with government subsidy negotiations, site selection processes and construction timelines generating sustained coverage before a single chip is produced. Export controls on advanced chips have added a national security and foreign policy dimension to what was primarily a technology and business beat, requiring coverage to hold both frames simultaneously. The concentration of advanced manufacturing capacity in a small number of facilities and geographies has made the semiconductor supply chain a recurring subject in economic security and trade reporting.