NSING Tops 250 Million Bluetooth Chips Shipped
NSING Technologies reports its Bluetooth products built on Ceva-Waves Bluetooth LE IP have passed 250 million units shipped.
Updated on Nov. 9, 2026 in Semiconductors
NSING Technologies says it has surpassed 250 million Bluetooth chips shipped that incorporate Ceva-Waves Bluetooth LE intellectual property. The milestone reflects the company's Bluetooth portfolio, which spans wearables, consumer electronics, smart home, automotive and industrial applications.
Why it matters
The milestone shows how licensed wireless connectivity IP can be combined with a chipmaker's own low-power RF and microcontroller designs to reach high shipment volumes. It also highlights Ceva's role as a licensor whose wireless IP is deployed across semiconductor companies worldwide.
NSING's Bluetooth solutions pair Ceva-Waves Bluetooth LE IP with the company's own low-power RF designs and MCU architectures, spanning the N32WB452 dual-core Bluetooth LE MCUs and N32WB03x ultra-low-power SoCs. The 250 million cumulative shipment figure is company-reported, and the source does not detail the shipment timeframe or per-product volumes.
The players
NSING Technologies
NSING Technologies is a provider of microcontrollers and semiconductor solutions whose Bluetooth LE MCUs and SoCs are used in wearables, consumer electronics, smart home and automotive products.
Ceva
Ceva is a licensor of silicon and software intellectual property whose Ceva-Waves wireless connectivity portfolio includes Bluetooth LE, Bluetooth Dual Mode, Bluetooth HDT, Wi-Fi and UWB, licensed by chipmakers worldwide.
The details
The milestone was announced in a collaboration between NSING Technologies, a microcontroller and semiconductor solutions provider, and Ceva, a licensor of silicon and software IP. NSING's Bluetooth products draw on Ceva's Bluetooth LE IP combined with its own low-power RF and MCU designs, a approach the company says helped it build integrated, power-efficient solutions and accelerate development.
Timeline
November 9, 2026: NSING Technologies announces it has shipped 250 million Bluetooth chips incorporating Ceva-Waves Bluetooth LE IP.
The Tech Race
The milestone reflects the licensing model Ceva uses for its Ceva-Waves wireless IP, which is embedded across chipmakers' own designs rather than sold as finished chips. Volume figures like this one show how that model is scaling across the global Bluetooth LE market.
Bluetooth LE chips built on this IP are used in wearables, smart home devices and automotive accessories, so the scale of deployment affects the range of connected products consumers can buy. The source does not say whether any specific consumer product price or availability will change as a result.
The takeaway
Licensed wireless IP combined with a chipmaker's own low-power design can scale quickly across consumer and industrial devices. Readers tracking connected products may see this kind of Bluetooth LE integration appear in a wider range of wearables and smart home hardware over time.
Further reading
Explore more semiconductor news and analysis to see how chip licensing and wireless connectivity are shaping the industry.
Source note: This article includes information reported by Everythingrf.
