Murata Starts Mass Production of Compact RF Connectors
The SWL series connectors measure 1.0 mm × 1.0 mm × 0.55 mm and cut PCB mounting area by about 40% versus the SWJ series.
Updated on Nov. 3, 2026 in Semiconductors
Murata Manufacturing has begun mass production of the SWL series MM8330-2600RJ5 and MM8330-2600RK20 RF test connectors. The connectors support frequencies from DC to 15 GHz and use a nominal impedance of 50 Ω.
Why it matters
Rising component counts in wireless devices leave limited room on printed circuit boards, and RF test connectors need clearance around the component for probe access. A smaller connector footprint helps designers fit more functions into compact smartphones and wearable devices.
The SWL series supports DC to 15 GHz with a nominal impedance of 50 Ω, and is supplied on reels of 5,000 pieces (MM8330-2600RJ5) or 20,000 pieces (MM8330-2600RK20). Independent performance data beyond these manufacturer specifications was not provided.
The players
Murata Manufacturing
Murata Manufacturing is a Japan-based electronic components company known for producing capacitors, inductors, RF modules, and sensors used across consumer and automotive electronics.
The details
The connectors use a proprietary structure that combines Murata's RF and mechanical design technologies. Using dedicated automatic or manual probes requires less clearance around the test point, which is what drives the footprint reduction.
Timeline
Mass production of the SWL series MM8330-2600RJ5 and MM8330-2600RK20 has begun.
Murata plans to commence mass production of dedicated probes in December 2026.
The Tech Race
The SWL series shrinks the RF test connector footprint roughly 40% below Murata's own SWJ series, a shift aimed at the same miniaturization pressure facing every smartphone and wearable maker. The move reflects a broader push among component suppliers to free board space as wireless device component counts climb.
Smaller RF test connectors give device designers more room on crowded boards for antennas, batteries, and processors. The footprint savings matter most in phones and wearables where every millimeter of board space is contested.
The takeaway
Engineers designing compact wireless products should track how RF test connector footprints are shrinking, since board layout decisions made now will determine how much room is left for future features. Test access requirements can be planned early to avoid costly redesigns.
What happens next
Murata plans to commence mass production of dedicated probes in December 2026, which is expected to further reduce PCB footprint for the SWL series.
Further reading
For broader context on how component miniaturization is shaping chip and board design, see our Semiconductors coverage.
Source note: This article includes information reported by ELE Times.
