Star Power Launches New Silicon Carbide Power Module
The MD53HFL120L2S_B20 module offers high-efficiency power management for compact PCB integration.
Updated on Oct. 29, 2026 in Semiconductors
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Star Power Semiconductor has introduced the MD53HFL120L2S_B20 silicon carbide half-bridge module. This new device is specifically engineered for seamless integration into printed circuit board designs.
Why it matters
The module allows engineers to incorporate advanced silicon carbide technology into existing power architectures without a complete redesign. This efficiency improvement supports the transition to more compact, high-performance power electronics.
The module is rated for 1,200 V and features a 120 A current class. It utilizes an aluminium nitride active metal brazed substrate to maintain performance standards while remaining compatible with existing silicon IGBT configurations.
The players
Star Power Semiconductor
Star Power Semiconductor is a developer and manufacturer of specialized power electronics components including IGBTs and SiC modules.
The details
The MD53HFL120L2S_B20 incorporates two SiC MOSFETs in a half-bridge configuration to optimize power density. By utilizing an aluminium nitride active metal brazed substrate, the device ensures thermal stability suitable for demanding PCB applications.
Timeline
Star Power Semiconductor will showcase the new module at the electronica 2026 trade show in Munich throughout 2026.
The Tech Race
The shift toward silicon carbide components is accelerating as manufacturers look to replace older silicon IGBT designs with more efficient, heat-resistant alternatives. This module positions Star Power to compete in the growing market for compact, high-voltage power conversion hardware.
Engineers and product designers can expect improved workflow efficiency when upgrading current power systems to accommodate higher voltage requirements. The design focus on PCB integration simplifies the adoption process for developers building next-generation electronic hardware.
The takeaway
The move toward standardized, board-mountable SiC modules reflects a broader industry trend toward smaller and more efficient power electronics. Designers looking to upgrade their systems should verify specific thermal and PCB clearance requirements before integration.
Further reading
Learn more about the latest innovations in semiconductors.
Source note: This article includes information reported by Elektronikpraxis.
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