Ampleon Launches New B10H24N70D Doherty MMIC Driver

The new two-stage amplifier simplifies RF design with integrated components and optimized bias control.

Updated on Oct. 26, 2026 in Semiconductors

Isometric editorial illustration of a small electronic component with metallic connector pins, representing high-performance radio frequency hardware.
Ampleon has debuted the B10H24N70D, a two-stage Doherty MMIC driver designed to simplify radio frequency power amplification for communication system engineers. AI Illustration. Upload story photo >

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Ampleon has released its B10H24N70D, a two-stage Doherty MMIC driver designed for efficient power amplification. The device features integrated ESD protection and independent bias control to streamline RF lineups.

Why it matters

By integrating the two-stage Doherty architecture into a single package, the device reduces complex external matching requirements. This simplifies the development process for engineers building high-performance communication systems.

The B10H24N70D operates within the 2300 MHz to 2400 MHz range using 50 V LDMOS technology. It delivers 20 percent efficiency and comes in a compact 7 mm by 7 mm LGA package.

The players

Ampleon

Ampleon is a global semiconductor company specializing in high-frequency power amplifiers for infrastructure and industrial applications.

The details

This MMIC driver utilizes independent carrier and peaking bias control, allowing developers to optimize performance for specific frequency needs. Its 50 Ohm input and output impedances facilitate easier integration into existing circuit designs.

Timeline

  1. October 26, 2026: Ampleon officially released the B10H24N70D MMIC driver.

The Tech Race

This release continues the industry-wide transition toward integrating complex RF components, replacing discrete, multi-part circuits with monolithic designs. It positions Ampleon to compete more effectively in the race for compact, high-efficiency network infrastructure hardware.

Engineers and product designers can expect simplified assembly workflows and reduced footprint requirements for new communication devices. This integration helps lower the barrier for deploying high-efficiency RF power systems in smaller, modern hardware formats.

The takeaway

The move toward highly integrated MMIC drivers demonstrates how chip manufacturers are prioritizing efficiency and design simplicity for developers. Adopting such components can lead to shorter development cycles and more compact electronic hardware.

Further reading

For more developments in chip design and hardware, visit the Semiconductors section.

Source note: This article includes information reported by Everythingrf.

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