onsemi Introduced New Embedded Power Platform
The semiconductor packaging system aims to improve efficiency and power density in future electric vehicles.
Updated on Oct. 12, 2026 in Semiconductors
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On September 16, 2026, onsemi announced its new Embedded Power Platform designed to integrate multiple semiconductor dies into a single system. The architecture is intended to enhance the performance of future electrified vehicles.
Why it matters
By replacing high-inductive wire bonds with precision wafer-level redistribution layers, the platform reduces heat loss and improves overall power density. These advancements are critical for optimizing traction inverter efficiency in modern vehicle designs.
The platform integrates silicon, silicon carbide, and gallium nitride dies directly into a single system. This architecture delivers a 3 to 5 times increase in power density compared to traditional inverters by utilizing wafer-level redistribution layers.
The players
onsemi
This semiconductor supplier specializes in power management and sensing solutions for automotive and industrial markets.
Subaru Corporation
Based in Japan, this multinational automaker is known for its vehicle production and research into electrified propulsion systems.
The details
The design enables the integration of field-effect transistors, drivers, and controllers by housing them in a unified packaging structure. Subaru Corporation has expressed interest in utilizing this technology to boost the capabilities of its future electrified vehicle lineup.
Timeline
On September 16, 2026, onsemi officially announced the launch of the Embedded Power Platform.
The Tech Race
This development represents a shift toward more complex, highly integrated semiconductor packaging to replace legacy wire-bonding methods. It positions onsemi to compete more aggressively in the high-growth sector of power electronics for the global electric vehicle market.
As this technology is integrated into future electric vehicles, drivers may benefit from increased range and more efficient power usage in their automobiles. These technical improvements aim to reduce vehicle weight and energy consumption by streamlining power management systems.
The takeaway
Advanced packaging platforms are becoming essential as automakers push for higher efficiency in electric drive systems. Adopting these integrated technologies can help manufacturers overcome thermal management challenges in next-generation transport.
Further reading
For additional context on industry trends, visit the Semiconductors section.
Source note: This article includes information reported by ELE Times.
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