Parker Hannifin Launched New Thermal Adhesives

The company introduced three new adhesive products designed to improve thermal conductivity for electrification platforms.

Updated on Oct. 6, 2026 in Materials Science

Macro view of an industrial nozzle dispensing a grey adhesive bead onto a copper electronic heat sink. — Parker Hannifin has expanded its Performance Materials Division with three new CoolTherm thermal adhesives, developed to improve heat conductivity and assembly for electrification platforms. AI Illustration. Upload story photo >

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Parker Hannifin has expanded its Performance Materials Division with the launch of three new CoolTherm thermal adhesives. These products are engineered to support the growing demand for thermally conductive bonding solutions in electrification technologies.

Why it matters

These adhesives are designed to meet the specific bonding requirements of modern electrification platforms, which rely on efficient heat management to maintain performance and durability. By offering specialized cure times and improved sag resistance, these materials aim to streamline complex assembly processes.

The new lineup includes the CoolTherm UR-2800, UR-2400 SLW, and TC-2080 adhesives. The UR-2400 SLW provides 2.0 W/m·K thermal conductivity, while the TC-2080 is engineered to maintain sag resistance in large beads by eliminating glass spacers.

The players

Parker Hannifin

Parker Hannifin is a global leader in motion and control technologies that provides precision-engineered solutions for a wide variety of mobile, industrial, and aerospace markets.

The details

Parker Hannifin designed these products to provide reliable bonding across diverse substrates with varying curing needs. The TC-2080 adhesive specifically removes the need for glass spacers, a move intended to enhance the structural stability of large-scale dispensed beads.

October 6, 2026: Parker Hannifin announced the new thermal adhesive products.

The Big Picture

This release aligns with the broader industry trend of prioritizing thermal management to support the high-power density requirements of electrification platforms. By introducing specialized adhesives, the firm is addressing a critical bottleneck in the manufacturing of reliable, high-performance power systems.

These new adhesives will likely improve the durability and efficiency of consumer electronics and electric vehicle components that require high-performance thermal bonding. Manufacturers adopting these materials may see reduced assembly times and improved structural reliability in their final product designs.

The takeaway

Effective thermal management is essential for the long-term reliability of modern electronic systems. Engineers should evaluate these new adhesive options to determine if their specific cure profiles and conductivity ratings can replace legacy materials in current production workflows.