Chemours Launches Faizeon Cooling Fluids for Data Centers

The new two-phase direct-to-chip and immersion fluids target high-density data center cooling, with HFO-based formulations.

Updated on Nov. 2, 2026 in Data Centers

Bold flat vector editorial illustration of a polished steel cold plate with coral fluid vaporizing through its channels, set against a cream field.
Chemours launched its Faizeon line of two-phase direct-to-chip and immersion cooling fluids this week to help high-density data centers manage rising AI chip heat. AI Illustration. Upload story photo >

Chemours has launched a Faizeon product line of two-phase direct-to-chip and immersion cooling fluids for high-density data centers. The portfolio includes HFOs and HFO blends, and the company confirmed the line includes five low-boiling-point dielectric fluids.

Why it matters

As AI and high-performance computing push chip heat loads higher, data center operators need more effective ways to remove heat from processors and racks. Phase change fluids that absorb heat by vaporizing offer one approach to meeting those cooling demands.

Independent third-party testing found a two-phase direct-to-chip system using Faizeon 200 fluid kept a GPU up to 19°C cooler than a single-phase, water-based fluid. The portfolio spans five low-boiling-point dielectric fluids, though the testing conditions and scale of deployment beyond this single comparison are not detailed.

The players

Chemours

A U.S.-based chemical company that has been developing thermal-management products, with its CEO citing 90 years of expertise in the field.

Samsung Electronics

A South Korean electronics manufacturer that qualified Opteon 2P50 for use with its fourth generation solid state drive.

2CRSi

A French server manufacturer that signed a joint development agreement with Chemours earlier this year.

NTT Data

A Japanese IT services company that hosted a full-scale trial of Opteon 2P50 with Chemours.

Navin Fluorine

An Indian chemical manufacturer that agreed to produce Chemours' HFO-based cooling fluid.

The details

Chemours said the Faizeon line includes four direct-to-chip fluids and one immersion cooling fluid, with Faizeon 500 being the immersion option previously announced as Opteon 2P50. The fluids absorb heat and change from liquid to vapour within direct-to-chip cold plates and immersion tanks used to cool CPUs, GPUs and high-wattage racks.

Timeline

  1. Chemours entered the immersion cooling market with an HFO-based fluid on July 31, 2023.

  2. Chemours launched a full-scale trial of Opteon 2P50 with NTT Data on March 14, 2025.

  3. Navin Fluorine agreed to manufacture Chemours' HFO-based cooling fluid on May 10, 2025.

  4. Samsung qualified Chemours' Opteon immersion cooling fluid on August 14, 2025.

Roadmap

Chemours' Opteon 2P50, previously announced for immersion cooling, is now folded into a broader Faizeon portfolio spanning direct-to-chip and immersion formats. The move reflects a wider shift among chemical suppliers toward low-boiling-point HFO fluids as data center heat loads climb.

For data center operators, two-phase cooling could change how much heat a rack can handle and how cooling hardware is specified. Faster adoption would matter most to facilities running dense GPU clusters where conventional cooling is reaching its limits.

The takeaway

Operators weighing liquid cooling should compare two-phase fluids on measured GPU temperature and deployment track record, not just specifications. The independent testing and partner qualifications cited here are the kind of evidence worth requesting before committing.

Further reading

For more on how cooling choices shape facility design, see Data Centers.