SECO Releases New Qualcomm Dragonwing Edge AI Module
The company launched engineering samples of its latest module for OEM developers to test advanced AI applications.
Updated on Oct. 27, 2026 in Semiconductors
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SECO has officially released engineering samples of the new SOM-SMARC-Dragonwing-IQ8 module to selected OEMs. This hardware is designed to accelerate the development of next-generation Edge AI and Physical AI applications.
Why it matters
By integrating high-performance AI capabilities with industry-standard interfaces, this module aims to simplify the development process for engineers building advanced edge computing systems. It provides a standardized path for companies to deploy AI directly on hardware, potentially speeding up time-to-market for intelligent devices.
The module features 40 TOPS of AI acceleration powered by the Qualcomm Hexagon NPU and supports 2.5 Gigabit Ethernet connectivity. It also incorporates PCIe Gen4, diverse camera interfaces, and CAN bus compatibility.
The players
SECO
An international technology company that specializes in the design and manufacturing of embedded systems, Internet of Things solutions, and edge computing hardware.
Qualcomm
A global leader in semiconductor and wireless technology that develops processors, software, and services for the mobile, automotive, and IoT industries.
The details
The module is built on the Qualcomm Dragonwing IQ8 Series and supports the Works with Arduino ecosystem to foster developer flexibility. Additionally, users can utilize Clea OS for remote device management and long-term software maintenance.
Timeline
October 27, 2026: SECO announced the availability of SOM-SMARC-Dragonwing-IQ8 engineering samples.
The Tech Race
The module's architecture is based on the Qualcomm Dragonwing IQ8 Series, representing the latest iteration of specialized chips for edge computing. This release marks a significant expansion of the platform into the modular SMARC standard to facilitate broader industrial adoption.
For OEM developers, this module offers a standardized interface that simplifies the integration of powerful AI features into new products. Engineers can now utilize established software ecosystems like Arduino and Clea OS to manage their deployments more effectively.
The takeaway
Developers looking to integrate AI into edge hardware should prioritize modules that offer integrated software maintenance and broad ecosystem compatibility. Standardized evaluation platforms are increasingly critical for reducing the complexity of physical AI projects.
Further reading
Learn more about the latest innovations in the Semiconductors industry.
Source note: This article includes information reported by Industry Europe.
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