SECO to Showcase New AI Module at electronica 2026

The company will debut the SOM-SMARC-Dragonwing-IQ8 module featuring high-performance AI acceleration starting November 10.

Updated on Oct. 20, 2026 in Semiconductors

A close-up view of a complex, industrial-grade circuit board with metallic components on a dark background, reflecting modern edge computing technology.
SECO will debut its new SOM-SMARC-Dragonwing-IQ8 edge AI module at the electronica 2026 trade show, beginning November 10 in Germany. AI Illustration. Upload story photo >

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SECO is set to unveil its new SOM-SMARC-Dragonwing-IQ8 module at the electronica 2026 trade show. The company will demonstrate the hardware alongside its Clea AI software platform during presentations on November 10 and November 12.

Why it matters

The new module integrates Qualcomm Dragonwing IQ8 Series technology to provide scalable Edge AI capabilities for developers. By combining hardware with the Clea OS platform, the solution streamlines the deployment and management of complex AI applications across device fleets.

The module utilizes the Qualcomm Hexagon neural processing unit to deliver up to 40 TOPS of AI acceleration. It is designed to work with the Arduino VENTUNO Q to simplify prototyping for Edge AI applications.

The players

SECO

This is a technology company that specializes in embedded computing and Internet of Things solutions.

Qualcomm

This is a multinational corporation that creates semiconductors, software, and services related to wireless technology.

The details

The SOM-SMARC-Dragonwing-IQ8 module includes compatibility with the Works with Arduino program, allowing designers to build and scale applications efficiently. SECO will host exhibits across multiple halls at the trade show, including locations at the Arrow stand and the CODICO booth.

Timeline

  1. 10 November 2026: Innovation presentation at Edge Lab LIVE!

  2. 12 November 2026: Edge deployment presentation at Edge Lab LIVE!

The Tech Race

This release follows a pattern set by the Works with Arduino program to standardize development platforms for industrial hardware manufacturers. It positions SECO's new module within the competitive race to offer plug-and-play AI acceleration for edge computing environments.

Developers and systems engineers can leverage this new module to shorten the prototyping timeline for AI-integrated devices. The inclusion of Clea OS provides users with centralized tools to manage security updates and software maintenance across their device fleets.

The takeaway

Designers should evaluate how combining hardware-level AI acceleration with a unified management platform like Clea can reduce long-term operational costs. Adopting standardized modules like those in the IQ8 Series can help ensure faster compatibility with existing development ecosystems.

Further reading

Learn more about the latest innovations in Semiconductors.

Source note: This article includes information reported by Embedded Computing Design.

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Do you believe the rapid integration of AI into industrial hardware will improve overall efficiency?