Festo Will Showcase Automation Tools at PACK EXPO 2026
The industrial firm will highlight new robotic grippers and multi-axis systems at the Chicago event.
Updated on Oct. 13, 2026 in Robotics
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Festo Corporation will present its latest industrial automation technologies at PACK EXPO in Chicago from October 18-21, 2026. The exhibit will highlight components designed to streamline machine building for packaging original equipment manufacturers.
Why it matters
Packaging OEMs frequently require solutions that reduce engineering time, costs, and complexity during machine builds. Festo's new systems aim to provide this efficiency through modular design and simplified software integration.
The HPSX gripper family handles items up to 1.1 lbs. with 15 g maximum acceleration and features an IP69K washdown rating. Pre-engineered FPaKit systems integrate motors, drives, and axes to reduce total assembly time by up to 15 hours.
The players
Festo Corporation
This global company specializes in industrial automation and pneumatic technology for factory and process automation.
The details
The showcase features the HPSX adaptive gripper family, which uses soft silicone fingers for versatile handling, and the FPaKit multi-axis system. Additionally, Seamless Connectivity 2.0 software allows motion systems to operate across Rockwell, Siemens, and Beckhoff PLC architectures.
Timeline
Festo will exhibit at PACK EXPO in Chicago from October 18-21, 2026.
The Tech Race
The introduction of Seamless Connectivity 2.0 reflects a industry-wide pivot toward interoperable software environments that transcend individual PLC manufacturers. This move directly challenges legacy closed-system approaches by allowing robotics to operate seamlessly across Rockwell, Siemens, and Beckhoff architectures.
Local manufacturers can leverage the Festo FAST program to receive next-day shipment of specified automation components, potentially reducing downtime during machine maintenance. The software suite also streamlines device configuration, lowering the technical barrier for engineers managing diverse PLC setups.
The takeaway
Advancements in modular design and cross-platform software are significantly reducing the engineering burden for packaging facilities. Firms looking to optimize production should evaluate how integrated multi-axis systems can replace bespoke build processes to save on labor hours.
Further reading
Discover more about the evolving landscape of Robotics.
Source note: This article includes information reported by Packaging World.
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