SMTA Renames Semiconductor Packaging Symposium
The trade group rebranded its upcoming San Francisco event to reflect an expanded focus on advanced integration tech.
Updated on Oct. 21, 2026 in Semiconductors
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The Surface Mount Technology Association has renamed its Wafer-Level Packaging Symposium to the Microelectronics Packaging & Integration Symposium. This change highlights an increased emphasis on advanced semiconductor packaging and 3D integration.
Why it matters
The renaming reflects the growing complexity of electronic systems and the need for broader technical discussion on packaging. By expanding the symposium's scope, the event aims to better address the rapid evolution of modern semiconductor manufacturing.
The revamped event scope now covers advanced semiconductor packaging and 3D integration technologies. Technical committee members are currently evaluating how these methods scale within modern electronic systems.
The players
Surface Mount Technology Association
The SMTA is a global organization dedicated to providing education and technical support for individuals and companies in the electronics manufacturing industry.
The details
The newly titled Microelectronics Packaging & Integration Symposium will incorporate an expanded technical program and exhibition floor. The technical committee is currently soliciting research abstracts to fill the sessions on these emerging manufacturing processes.
Timeline
December 10, 2026: The deadline for submitting research abstracts for the symposium.
February 9-11, 2027: The scheduled dates for the Microelectronics Packaging & Integration Symposium in San Francisco.
The Tech Race
This rebranding marks a departure from traditional chip-packaging silos toward a more holistic approach centered on 3D semiconductor integration. The move aligns the organization with the broader industry effort to overcome performance bottlenecks in current microchip architectures.
Engineers and industry professionals in San Francisco can now engage with a wider array of technical sessions and exhibitions focused on the next generation of chip design. Participants should update their conference schedules to account for the broadened technical scope and upcoming deadlines.
The takeaway
The rebranding signifies that modern hardware advancements require a more unified approach to integration and packaging. Professionals in the field should review the new technical focus areas to ensure their research remains aligned with these evolving standards.
What happens next
Prospective presenters must submit their research abstracts by December 10, 2026.
Further reading
For more on industry developments, visit the Semiconductors page.
More information
View the symposium website and abstract submission to register for the upcoming event.
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