Hanmi Semiconductor Unveiled HBM4 Equipment in San Francisco
The company debuted new TC and FC Bonder models at the Semicon West 2026 conference held at the Moscone Center.
Updated on Oct. 14, 2026 in Semiconductors
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Hanmi Semiconductor introduced a new suite of packaging equipment at Semicon West 2026 to support the growing production of HBM4 memory chips. The debut includes five specialized models designed to optimize the assembly of next-generation AI semiconductors.
Why it matters
As global memory manufacturers ramp up mass production of HBM4, the demand for sophisticated manufacturing technology has surged. This equipment aims to meet increasing investments in AI semiconductor production across the United States.
Hanmi Semiconductor introduced five new models, including the TC Bonder 4 for HBM4 production, alongside three 2.5D TC Bonder and two FC Bonder units. This equipment facilitates high-precision bonding and stacking of memory chips using heat and pressure.
The players
Hanmi Semiconductor
This company is a leading manufacturer of semiconductor back-end process equipment.
The details
The newly unveiled 2.5D packaging technology utilizes silicon interposers to integrate GPUs, CPUs, and HBM into a single high-performance package. Additionally, the company showcased its Micro Saw & Vision Placement process, which automates cutting, cleaning, drying, inspection, sorting, and loading.
Timeline
Hanmi developed its micro-saw technology in 2021.
Semicon West 2026 takes place in San Francisco from October 13-15, 2026.
The company has scheduled the Wide TC Bonder for release in 2027.
The Tech Race
The introduction of this packaging suite mirrors the intense industry-wide competition to optimize 2.5D stacking processes for AI hardware. By launching these specific bonders, the company positions itself to challenge existing back-end process providers in the foundry market.
Increased availability of specialized assembly equipment can reduce production bottlenecks, potentially lowering the costs of high-performance AI hardware for developers and data centers. As these technologies are adopted, stakeholders can expect improved efficiency in the manufacturing pipeline for modern GPUs and CPUs.
The takeaway
Advancements in packaging technology are currently the primary bottleneck for AI hardware production speed and capacity. Manufacturers should monitor the 2027 rollout of the Wide TC Bonder as a signal for when high-volume HBM4 production could reach its next maturity phase.
What happens next
The Wide TC Bonder is scheduled for release in 2027, marking the next expansion phase for the company’s product line.
Further reading
For more on the current manufacturing trends in the industry, visit the Semiconductors section.
Source note: This article includes information reported by 조선일보.
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