pSemi Released New IoT Front-End Modules
The company launched two silicon-on-insulator modules designed to extend the range of 2.4 GHz IoT devices.
Updated on Oct. 9, 2026 in Semiconductors
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pSemi Corporation has released the PE566212 and PE566213, two new front-end modules engineered for 2.4 GHz IoT applications like Bluetooth and Thread. These integrated devices utilize the proprietary UltraCMOS+ process to boost signal range.
Why it matters
By integrating a power amplifier, low noise amplifier, and RF switch into a compact module, these products help overcome the range limitations inherent in many standalone system-on-chip IoT designs.
The modules feature a transmit output of +20 dBm, a receive noise figure of 1.8 dB at 13 dB of gain, and a bypass-path loss of 0.8 dB. They are housed in an LGA package measuring 1.8 mm by 1.8 mm by 0.63 mm.
The players
pSemi Corporation
A subsidiary of Murata Manufacturing that specializes in the design and integration of semiconductor technologies.
The details
The modules leverage a monolithic silicon-on-insulator design to combine critical radio frequency components into a singular footprint. This architecture is specifically optimized for low-power connectivity standards including Zigbee, Bluetooth, and Thread.
Timeline
pSemi Corporation announced the new front-end modules on October 9, 2026.
The Tech Race
The semiconductor industry is currently prioritizing the integration of front-end components to satisfy the extreme space constraints of modern IoT hardware. This move positions pSemi against competitors focusing on discrete component assemblies that often result in larger board footprints.
Device designers can use these modules to significantly shrink the size of smart home sensors and wearables without sacrificing connectivity. Consumers will benefit from smaller, longer-range connected devices that maintain more reliable links in crowded wireless environments.
The takeaway
Advancements in silicon-on-insulator design are making high-performance radio integration accessible for low-power IoT networks. Engineers aiming to improve product range should consider how monolithic module integration can optimize both energy efficiency and physical dimensions.
Further reading
Learn more about the latest innovations in this field in the Semiconductors section.
More information
View the full technical specifications on the pSemi 2.4 GHz IoT module product information page.
Source note: This article includes information reported by Microwave Journal.
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