Movandi Unveils 60GHz Platform With MV6055 Chip
The modular platform targets low-latency connectivity for physical AI devices and began sampling with key partners.
Updated on Nov. 3, 2026 in Semiconductors
Movandi unveiled a 60GHz connectivity platform powered by its MV6055 transceiver, which has begun sampling with key partners. The platform supports peak data rates above 5Gbps and line-of-sight links beyond one kilometer.
Why it matters
Physical AI devices generate large volumes of data that must be processed with low latency, and processing everything locally raises power, cost and complexity while sending it all to the cloud adds delay. The platform offers a middle path by selectively offloading compute-intensive AI workloads to nearby edge processing and cloud services.
The platform supports peak data rates above 5Gbps and line-of-sight links beyond one kilometer across the 57-70GHz band, with MIMO support and low-power transmit and receive operation. Movandi has not disclosed independent benchmarks or commercial availability dates for these specifications.
The players
Movandi
Movandi is a connectivity semiconductor company headquartered in Irvine, California, that holds more than 130 issued patents and has recently opened operations in Muscat, Oman and Riyadh, Saudi Arabia.
The details
The platform combines silicon with application-specific antenna configurations and system software, using a modular, scalable architecture that can be configured for different range, performance and cost requirements in each market. It also provides a path toward future integrated sensing and communication capabilities.
Timeline
Movandi announced the 60GHz platform and began MV6055 sampling on November 3, 2026.
The Tech Race
The 60GHz band was first commercialized for short-range consumer links under the IEEE 802.11ad WiGig standard, which kept range limited to a few meters. Movandi's platform pushes the same band toward line-of-sight links beyond one kilometer, positioning it against rival wireless approaches for industrial and AI edge connectivity.
For device makers building physical AI products, the platform offers a way to offload heavy AI workloads without relying entirely on local processing or constant cloud connectivity. Engineers evaluating the MV6055 should weigh its modular configurations against the specific range, power and cost targets of their own systems.
The takeaway
Connectivity design for physical AI increasingly means splitting work between the device, nearby edge processing and the cloud rather than choosing one. Developers should plan for that split early in hardware selection.
Further reading
Explore more Semiconductors coverage for context on the chips behind this platform.
Source note: This article includes information reported by Rfglobalnet.
