Interlink Electronics to Exhibit at Electronica, Medica
The Nasdaq-listed sensor maker will showcase its technologies at two European trade fairs in November 2026.
Updated on Nov. 2, 2026 in Job Fairs
Interlink Electronics Inc. will exhibit at Electronica in Munich, Germany, from November 10 to 13, 2026, and at Medica in Düsseldorf, Germany, from November 16 to 19, 2026. The company's engineers and product specialists will be available at both events to discuss design requirements, custom sensor development, and integration support.
Why it matters
The fairs give attendees a direct opportunity to see live demonstrations of sensor and printed-electronics technologies and to consult with the company's specialists. For the sensor and printed-electronics sector, the appearances offer a venue for engineers to evaluate product integration options.
Interlink will exhibit at Electronica at booth B4 223 from November 10 to 13 and at Medica at booth 12D54 from November 16 to 19, 2026. The company's Electronica presentation is scheduled for November 12 at 1:40 pm on the Smart Mobility Stage in Hall B4, but the extraction does not specify the presentation topic.
The players
Interlink Electronics Inc.
A Fremont, California-based sensor and printed-electronics company traded on Nasdaq under the symbol LINK, operating manufacturing in Shenzhen, China and facilities in Irvine and Scotland.
Declan Flannery
Vice President of Force Sensing Solutions at Interlink Electronics, who will present at Electronica.
The details
Declan Flannery, Vice President of Force Sensing Solutions, will give a presentation at Electronica on November 12. Attendees may visit the booths for live demonstrations and one-on-one consultations with Interlink's engineers.
Timeline
November 10-13, 2026: Electronica exhibition in Munich, Germany.
November 12, 2026, 1:40 pm: Declan Flannery presentation on the Smart Mobility Stage.
November 16-19, 2026: Medica exhibition in Düsseldorf, Germany.
Market Landscape
Interlink's appearances at Electronica and Medica position its force-sensing and printed-electronics capabilities alongside peer suppliers at Europe's leading electronics and medical-technology fairs. The company's Shenzhen printed-electronics center and smart-textile footprint in Rotherham, England, extend its manufacturing and development reach beyond its California headquarters.
Engineers and product designers evaluating sensor or printed-electronics components can attend either show to speak directly with Interlink's specialists about custom development and integration. Attendance requires travel to Munich or Düsseldorf during the listed exhibition dates.
The takeaway
Companies evaluating sensor integration can use these trade fairs to compare vendor capabilities in person before committing to custom development. Scheduling meetings in advance of the November dates may help secure time with product specialists.
What happens next
Interlink Electronics will present at Electronica on November 12, 2026, at 1:40 pm, and exhibit at Medica from November 16 to 19, 2026.
Further reading
Explore more on Job Fairs for context on industry events where companies recruit and showcase technical talent.
Source note: This article includes information reported by The Manila times.
