Lam and imec Partner to Advance Chip Manufacturing
The companies are collaborating on 3D integration and high-NA EUV patterning to support growing AI workloads.
Updated on Oct. 28, 2026 in Semiconductors
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Lam Research and imec announced a research collaboration to accelerate the transition of semiconductor innovations into high-volume manufacturing. The effort focuses on 3D integration, advanced packaging, and memory architectures to meet increasing demand for AI compute power.
Why it matters
As AI workloads place unprecedented pressure on memory density and bandwidth, this research aims to bridge the gap between laboratory developments and practical, scalable chip production. The work targets essential manufacturing processes like plasma dicing and thick dielectric deposition.
Joint testing achieved single-exposure high-NA EUV patterning for 20 nm ruthenium direct metal etch interconnects. The Aether dry resist platform was validated within imec's high-NA EUV research environment to test sensitivity and resolution.
The players
Lam Research
This global supplier provides wafer fabrication equipment and services for the semiconductor industry.
imec
This international research and development hub specializes in nanoelectronics and digital technologies.
The details
The partnership leverages Lam's expertise in deposition and etch alongside imec's advanced integration infrastructure. The researchers are specifically targeting next-generation gate-all-around and complementary FET architectures to drive future AI advancements.
Timeline
The research collaboration was formally announced in October 2026.
The Tech Race
This collaboration signals a pivotal move toward scaling high-NA EUV lithography beyond the laboratory. By replacing older lithography methods, the companies aim to secure competitive advantages in the race to produce the dense memory architectures required for modern AI.
This research directly impacts users by enabling the development of more powerful, energy-efficient AI processors found in future consumer hardware. Advancements in memory bandwidth and density will eventually translate into improved performance for AI-driven software and devices.
The takeaway
These breakthroughs in patterning and integration are essential for maintaining the pace of Moore's Law in the era of AI. Future consumer electronic improvements depend on these fundamental manufacturing innovations moving efficiently from research labs to factory floors.
Further reading
For more on the current state of the global chip industry, explore our Semiconductors section.
Source note: This article includes information reported by Electronics Weekly.
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