TME Adds Raytac Bluetooth Modules to Catalog
The distributor has expanded its offerings with Raytac BLE modules supporting advanced wireless standards and versatile connectivity.
Updated on Oct. 23, 2026 in Semiconductors
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TME has officially added a new line of Raytac Bluetooth Low Energy modules to its electronic component catalog. These modules integrate radio functionality and microcontrollers to assist designers in simplifying complex RF development.
Why it matters
By providing pre-integrated modules, TME aims to help electronics developers reduce the complexity of RF system design and accelerate the time to market for new products. The hardware supports multiple connectivity standards to ensure compatibility across a wide range of industrial and consumer devices.
The modules feature program memory from 192KB to 1.5MB and operate on supply voltages between 1.7V and 5.5V DC. They support receiver sensitivity of -103dBm and maintain operational stability in temperature ranges from -40°C to +105°C.
The players
TME
TME is an international distributor of electronic components, industrial automation equipment, and test instrumentation.
Raytac
Raytac is a manufacturer specializing in the development of Bluetooth Low Energy modules and wireless connectivity solutions.
The details
These components leverage Arm Cortex-M4F or Cortex-M33 processor cores and support Bluetooth versions ranging from BLE 4.0 to 6.2. The hardware also provides compatibility for ANT+, Thread, Zigbee, and IEEE 802.15.4 protocols, featuring AES-128 encryption for secure data transmission.
Timeline
TME added the Raytac BLE modules to its component catalogue on October 23, 2026.
The Tech Race
The transition toward highly integrated modules reflects a broader industry movement to replace discrete component layouts with consolidated platforms. By leveraging the Nordic nRF54 system, these modules push the performance ceiling for wireless data transfer beyond traditional Bluetooth limitations.
Electronics designers can now utilize these modules to expedite prototype assembly and improve the reliability of wireless connectivity in new hardware. The surface-mount design allows for easier integration onto host device PCBs, potentially lowering the manufacturing barrier for small-scale developers.
The takeaway
Using pre-certified, integrated modules is an effective strategy for developers looking to minimize hardware development time while maintaining robust wireless performance. Designers should verify the specific memory and power requirements of these modules against their project architecture before implementation.
Further reading
For more information on hardware integration and connectivity, visit the Semiconductors section.
Source note: This article includes information reported by Electronics For You - Official Site ElectronicsForU.com.
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