Siemens Launches Tessent Silicon Executable Software
The new platform integrates with automated test equipment to streamline testing for high-speed semiconductor interfaces.
Updated on Oct. 21, 2026 in Semiconductors
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Siemens has released its Tessent Silicon Executable software, designed to translate test patterns for high-speed interfaces. This software integrates directly into automated test equipment to bridge the gap between test creation and execution.
Why it matters
As semiconductor designs grow more complex and operating frequencies rise, traditional testing methods are struggling with longer durations and rigorous requirements. This software aims to resolve these bottlenecks by embedding directly into the testing environment.
The Tessent Silicon Executable software enables testing for PCIe Gen 6 interfaces by applying test patterns directly through target execution environments. It specifically supports integration with the Advantest V93000 and the Teradyne UltraPort instrument.
The players
Siemens
A multinational technology conglomerate that provides industrial software and automation solutions for the semiconductor and manufacturing sectors.
Advantest
A global manufacturer of automated test equipment used for the design and production of semiconductors.
Teradyne
A supplier of automated test equipment that specializes in testing semiconductor devices and electronic systems.
The details
The software functions by consuming Tessent-generated collateral and applying it to hardware, effectively aligning test creation with real-world execution. Major industry players Advantest and Teradyne have already incorporated this tool into their existing automated test platforms.
Timeline
October 20, 2026: Siemens announced the Tessent Silicon Executable software.
The Tech Race
This software marks a shift toward tighter integration between design automation and physical testing hardware to keep pace with the PCIe Gen 6 standard. By bridging these two previously siloed domains, companies aim to replace older, slower manual test methods with streamlined, automated execution.
For semiconductor manufacturers, this integration offers a more efficient workflow by reducing the complexity of testing high-frequency components. Engineers and test operators can expect faster deployment of test patterns, potentially accelerating the time it takes to bring new chips to market.
The takeaway
Advancements in automated test software are essential for maintaining quality control as chip complexity continues to scale. Industry professionals should monitor how this level of integration becomes standard across other high-speed interface testing platforms.
Further reading
Learn more about the latest developments in the industry at /tech/semiconductors/.
Source note: This article includes information reported by DQ.
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