Bourns Releases New Current Sense Resistor Modules
The new series of modules features integrated temperature sensing for high-power electronic applications.
Updated on Oct. 21, 2026 in Semiconductors
Bourns has introduced the CSI2F-6918, CSI2F-7036, CSI2F-8518, and CSI2F-8536 series of current sense resistor modules. These components are designed to support continuous power ratings up to 36 W at 125 °C.
Why it matters
The inclusion of integrated thermistors and voltage-sense connections allows for more precise temperature compensation in demanding power management systems. This provides engineers with greater control over resistance accuracy under varied thermal conditions.
The new resistor modules provide resistance values ranging from 25 to 200 µΩ and operate in a temperature range between -40 and +125 °C. Each unit includes a 10 kΩ NTC thermistor to support local temperature feedback.
The players
Bourns
Bourns is a global manufacturer of electronic components including sensors, circuit protection solutions, and magnetic products for the automotive and industrial sectors.
The details
The modules support both horizontal and vertical connector configurations and are available with either bare copper or tinned terminals. Voltage-sense connections allow the modules to compensate for resistance changes caused by fluctuating temperatures.
Timeline
Bourns announced the new series of resistor modules on October 21, 2026.
The Tech Race
The transition toward integrating sensors directly into power components reflects a broader industry movement toward miniaturized, self-correcting circuit architecture. This strategy allows Bourns to compete by reducing the total footprint required for thermal compensation compared to discrete sensor designs.
For design engineers, these modules simplify the implementation of thermal management in power-intensive hardware. The standardized connection options and integrated sensors allow for faster assembly and improved operational stability in end-user electronic devices.
The takeaway
Advancements in current sensing technology allow for more efficient heat management in high-power electronics. Engineers should consider how integrated thermal feedback can replace external sensing circuits to save board space and improve accuracy.
Further reading
For more information on component design, visit the Semiconductors section.
Source note: This article includes information reported by Electrical Engineering News and Products.
