Micro-Epsilon Launches 90-Degree Wafer Sensor
The new IMP-NIR-TH3/90/IP68 sensor features an integrated air purge for stable semiconductor wafer thickness measurements.
Updated on Oct. 20, 2026 in Semiconductors

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Micro-Epsilon has released a new white light interferometer sensor designed for high-precision thickness measurements of semiconductor wafers. The device utilizes a 90-degree beam path to facilitate integration within restricted industrial installation spaces.
Why it matters
The sensor addresses the challenge of measuring highly doped wafers in environments characterized by high particle loads and humidity. Its compact design and IP68-rated housing ensure stability and performance in demanding production conditions.
The system achieves a z-axis resolution of less than 1nm and a measuring rate up to 6kHz. It is compatible with multiple interface standards including EtherCAT, Profinet, and EtherNet/IP.
The players
Micro-Epsilon
Micro-Epsilon is a global manufacturer specializing in high-precision sensors and measurement systems for industrial applications.
The details
Equipped with an integrated air purge device, the sensor maintains optical clarity by preventing particle buildup on the lens. The device functions with a 3mm working distance and is powered by the IMS5420 controller to process data for thicknesses between 50 and 1050µm.
Timeline
October 20, 2026: Official announcement date for the new sensor.
The Tech Race
This development represents an iterative improvement in white light interferometry sensors by optimizing the beam path for modern manufacturing constraints. It helps manufacturers move away from standard linear configurations toward compact setups required for high-density chip fabrication.
Engineers and production managers can expect improved workflow reliability when measuring delicate wafers in contaminated environments. The inclusion of diverse interface options simplifies the integration process with existing factory automation software.
The takeaway
The implementation of a 90-degree beam path allows for more flexible machine design in semiconductor plants with limited floor space. Maintaining clean optics via air purge technology remains a critical factor in ensuring long-term measurement accuracy.
Further reading
Learn more about the latest innovations in Semiconductors.
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