Molex Unveils New Radio Frequency Component Designs
Molex and Smiths Interconnect introduce advanced radio frequency hardware for aerospace and defense applications.
Updated on Oct. 16, 2026 in Semiconductors
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Molex presented new radio frequency component designs at European Microwave Week, highlighting increased efficiency for defense hardware. Smiths Interconnect also debuted its EasiCoax solderless connector during the event.
Why it matters
Aerospace and defense designers face mounting pressure to reduce the physical footprint of circuit boards while maintaining high performance. These new components aim to address these demands by minimizing size and power usage.
The EasiCoax connector supports performance up to 40 gigahertz using a single spring-loaded piece design. This configuration eliminates the need for soldering and ensures self-aligned connections within an interposer.
The players
Molex
Molex is a manufacturer that produces radio frequency components and electronic interconnect solutions for the aerospace and defense sectors.
Smiths Interconnect
Smiths Interconnect is a global technology company that specializes in connectivity solutions for high-performance and harsh-environment applications.
The details
Molex is integrating multiple functions into single units to remove component interfaces, which effectively reduces signal insertion loss and eliminates common component mismatches. These designs prioritize streamlined architecture to improve production speeds and overall system reliability.
Timeline
European Microwave Week took place in October 2026.
The Tech Race
The EasiCoax connector marks a departure from the industry-standard soldering assembly method by utilizing a spring-loaded, solderless interface. This shift reflects a broader effort to replace legacy manual assembly processes with integrated, high-frequency-ready components.
These engineering advancements improve the reliability and lifespan of critical communications equipment used in high-stakes environments. Users may see faster development cycles for specialized technology as companies adopt these integrated, solderless modules.
The takeaway
Designers looking to optimize circuit boards should evaluate how integrated units can reduce signal loss in complex radio frequency systems. Moving toward solderless, spring-loaded connections can also simplify maintenance and physical integration in aerospace equipment.
Further reading
For more information on the evolving landscape of micro-electronics, visit our Semiconductors section.
Source note: This article includes information reported by Electronic Specifier.
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