ASM International Deployed Flowable Carbon Technology
The new plasma-enhanced process enables self-planarizing material deposition for complex semiconductor structures.
Updated on Oct. 14, 2026 in Semiconductors
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ASM International has moved its Flowable Carbon technology into high-volume production for semiconductor manufacturing. This plasma-enhanced deposition process allows materials to self-planarize, filling complex structures without the need for additional chemical mechanical planarization steps.
Why it matters
As 3D device scaling progresses, filling dense structures without voids has become increasingly difficult for manufacturers. This technology increases production yield and simplifies workflows by reducing the number of steps required to build advanced chips.
The Flowable Carbon technology operates within a temperature range of 200°C to 900°C. It effectively fills intricate 3D NAND structures that feature aspect ratios as high as 200:1.
The players
ASM International
This company is a global supplier of semiconductor process equipment that specializes in deposition technologies.
The details
The technology eliminates the need for etch-back and chemical mechanical planarization processes by allowing the material to reflow into narrow chip features. Researchers in Belgium and Finland developed the solution to address the increasing difficulty of uniform material deposition in three-dimensional architectures.
Timeline
Development of the Flowable Carbon program began six to seven years ago.
Logic foundries started working on gate-all-around device architectures four to five years ago.
The technology is currently in high-volume production.
Future 3D DRAM architectures are expected to drive demand for new fill technologies five to seven years from now.
The Tech Race
This development represents a critical shift toward reducing the complexity of the roughly 1,000 process steps currently required to produce a single chip. It positions the manufacturer to better compete in the escalating industry race to scale 3D DRAM and other advanced logic devices.
The transition to more efficient chip manufacturing processes aims to increase the supply and reliability of high-performance components used in consumer electronics. Over the long term, these process improvements contribute to the continued scaling and performance gains expected in future mobile and computing devices.
The takeaway
Advancements in deposition technology are becoming essential as chip architectures push further into the third dimension. Manufacturers seeking to maintain competitive output must prioritize process simplifications that reduce reliance on legacy planarization techniques.
Further reading
Learn more about the latest innovations in Semiconductors.
Source note: This article includes information reported by EE Times.
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