Industrial Firms Led Power GaN Patenting in Q2 2026
Patent activity for power gallium nitride technology saw roughly 500 new families published during the second quarter.
Updated on Oct. 7, 2026 in Semiconductors
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Industrial assignees dominated power gallium nitride (GaN) patent filings in Q2 2026, with approximately 500 patent families published. The sector also saw 800 new individual patents granted during this period.
Why it matters
Patent protection strategies are critical as manufacturers seek to secure intellectual property rights in competitive global semiconductor markets. Growth in this sector highlights a sustained emphasis on thermal management across devices and applications.
Approximately 300 patent families received a first-time grant, while 100 new entrants joined the landscape. Notably, 70% of these newcomers are based in China, with 75% of their activity focused on circuits and applications.
The players
Innoscience
This semiconductor company maintains a competitive stance in patent grants alongside major international peers.
Texas Instruments
The firm is a major industrial player in the semiconductor space that reached parity in new patent grants during the quarter.
Samsung
This global technology conglomerate remains a significant force in the power GaN intellectual property landscape.
WaveLord
The company serves as a key innovator leading patent activity in the specific area of wafers and epiwafers.
Nexperia
This entity led industry patenting efforts regarding the development of packaging and modules.
The details
Patent efforts primarily targeted the USA and China, with inventions heavily concentrated on power GaN devices alongside circuit applications. Thermal management proved a recurring technical challenge, appearing across various research areas including wafers, modules, and packaging.
Timeline
About 500 power GaN patent families were published during Q2 2026.
The Tech Race
The rise of China-based entities in semiconductor intellectual property filings represents a massive shift in the global technology landscape. This surge displaces legacy dynamics in Japan and Taiwan, signaling a new era of competition for control over semiconductor innovations.
The proliferation of these patents suggests that future consumer electronics and industrial equipment will feature improved power efficiency and thermal performance. Users can expect more compact, heat-resistant components as these inventions transition from research to commercial hardware.
The takeaway
The rapid influx of new players into the GaN landscape indicates that the barrier to entry for power semiconductor design is shifting. Companies should monitor these intellectual property trends to anticipate future changes in component pricing and availability.
Further reading
Learn more about the latest innovations and industry shifts in Semiconductors.
Source note: This article includes information reported by Semiconductor Today.
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