BOS Semiconductors Joined MIRISE Chiplet Project
The partnership focuses on developing advanced interconnect technologies for future automotive systems.
Updated on Oct. 7, 2026 in Semiconductors
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BOS Semiconductors has been selected as a technology partner for MIRISE Technologies Corporation to support an automotive chiplet research and development project. This collaboration aims to accelerate innovation in intelligent mobility systems.
Why it matters
The partnership leverages specialized design expertise to advance automotive chiplet interconnects. This development is crucial for creating the next generation of semiconductor architectures required for modern vehicle intelligence.
BOS Semiconductors brings automotive SoC experience and chiplet-based design expertise to the research initiative. The company previously demonstrated its technical capabilities by taping out its first AI accelerator in 2024.
The players
BOS Semiconductors
This company is a semiconductor technology firm based in South Korea that specializes in automotive SoC and AI accelerator development.
MIRISE Technologies Corporation
Headquartered in Nisshin-shi, Japan, this organization focuses on the research and development of advanced automotive electronics.
The details
BOS Semiconductors will provide critical design input for the development and prototyping of automotive chiplet interconnect technologies. The joint effort is intended to drive innovation across the global semiconductor ecosystem for future intelligent mobility.
Timeline
2020: MIRISE Technologies Corporation was established.
2024: BOS Semiconductors successfully taped out its first AI accelerator.
October 7, 2026: The partnership between BOS Semiconductors and MIRISE Technologies was announced.
The Tech Race
The development of automotive chiplet interconnect technologies represents a paradigm shift in how vehicle hardware integrates disparate silicon dies, marking a move away from monolithic system-on-chip designs. This partnership positions the involved firms to lead the evolving market for complex, high-performance automotive computing modules.
This collaboration will eventually influence the computing power and efficiency of future vehicle systems. Drivers can expect more intelligent mobility features as these chiplet designs move from prototype to production phases.
The takeaway
The move toward modular chiplet designs in automotive engineering highlights an industry-wide push for greater scalability and performance in car hardware. Future vehicle systems will increasingly rely on these advanced interconnects to manage complex data loads efficiently.
Further reading
Learn more about the latest innovations in the industry on our Semiconductors page.
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Do you believe advanced chip technology will make your next vehicle safer and more reliable?
