T2M Has Launched Bluetooth 6.3 RF IP Cores
The new Bluetooth 6.3 RF IP cores support advanced ranging capabilities and Channel Sounding for device connectivity.
Updated on Oct. 6, 2026 in Semiconductors
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T2M has announced the availability of its new Bluetooth 6.3 RF IP cores for licensing. These cores are designed for integration into System-on-Chip (SoC) architectures to improve precision and performance.
Why it matters
The IP cores address the growing need for highly accurate distance measurement and improved efficiency in congested wireless environments. By supporting Channel Sounding, the technology enhances capabilities for digital keys, industrial automation, and asset tracking.
The new RF IP cores are available in 22 nm ultra-low leakage (ULL) and 40 nm ultra-low power (ULP) process nodes. These architectures are optimized to function within the 2.4 GHz frequency band.
The players
T2M
T2M is a semiconductor IP provider and a member of the Bluetooth Special Interest Group.
The details
T2M leverages silicon-proven RF architectures to help developers reduce integration risks during subsystem development. The technology integrates directly with compatible modem, controller, and software components to enable more reliable device performance.
Timeline
October 15, 2026: T2M will attend the GlobalFoundries Technology Summit Europe in Munich.
November 19-20, 2026: T2M will participate in the ICCAD Expo in Beijing.
The Tech Race
This release follows the industry-wide shift toward integrating Bluetooth Channel Sounding for more secure and precise proximity sensing. It marks a push to replace legacy wireless ranging methods with more robust silicon-level solutions.
Device manufacturers can leverage this technology to develop more responsive digital keys and highly accurate asset tracking systems. These improvements may lead to better battery life and more reliable connectivity in future consumer electronics.
The takeaway
The move toward Bluetooth 6.3 highlights a broader industry trend of prioritizing low-power, high-precision connectivity at the silicon level. Designers should consider these process-agnostic IP cores to streamline integration for their next generation of wireless products.
Further reading
Learn more about the latest innovations in the chip industry in our Semiconductors section.
Source note: This article includes information reported by Design-reuse.
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