Valens and onsemi Partnered for Automotive Sensors

The two firms will develop integrated sensors for high-volume automotive camera systems.

Updated on Sept. 22, 2026 in Semiconductors

Isometric editorial illustration of a modular automotive sensor and lens assembly, representing high-volume vehicle camera hardware development.
Valens Semiconductor and onsemi have partnered to develop integrated 3MP automotive sensors utilizing MIPI A-PHY technology to streamline vehicle camera architectures. AI Illustration. Upload story photo >

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Valens Semiconductor has announced a collaboration with onsemi to create cost-optimized, 3MP integrated automotive image sensors. The partnership utilizes MIPI A-PHY technology to streamline camera designs by reducing component counts.

Why it matters

By embedding high-speed data transmission technology directly into sensors, the firms aim to simplify the architecture for vehicle camera systems. This integration targets the high-volume automotive market to lower overall hardware requirements.

The companies are building MIPI A-PHY technology directly into onsemi sensors to enable high-speed data transmission. This design is focused on the high-volume 1MP-3MP automotive image sensor market.

The players

Valens Semiconductor

This company provides high-performance connectivity solutions for the automotive and audiovisual markets.

onsemi

The corporation is a global supplier of intelligent power and sensing technologies for automotive and industrial applications.

The details

The collaboration leverages the MIPI A-PHY standard to facilitate efficient data connectivity in vehicle systems. Valens anticipates that revenue from these automotive design-win programs will begin to ramp up in 2027.

Timeline

  1. Q2 2026: Valens recorded $18.1 million in total revenue.

  2. Monday, September 21, 2026: VLN stock increased 8% in premarket trading.

  3. 2027: Expected ramp-up period for revenue from new automotive design-win programs.

The Tech Race

The transition to integrated chipsets follows the broader industry push to minimize cabling weight and complexity in modern vehicle electronics. This partnership mirrors the trend of semiconductor firms moving beyond standalone components to offer unified, system-level solutions.

Automotive manufacturers stand to benefit from reduced component counts, which can simplify assembly and potentially lower manufacturing costs for advanced camera systems. These efficiencies may eventually lead to more widespread adoption of high-resolution safety cameras in consumer vehicles.

The takeaway

The partnership highlights a shift toward highly integrated hardware that combines data transmission and sensing into a single unit. As manufacturers look to scale 3MP camera adoption, the ability to reduce component count becomes a critical factor for long-term production viability.

Further reading

Learn more about the latest innovations in the Semiconductors industry.

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