T2M Has Expanded Automotive IP Core Portfolio

The semiconductor firm added new connectivity and memory interfaces to streamline automotive chip development.

Updated on Sept. 22, 2026 in Semiconductors

Isometric editorial illustration of a silicon wafer with intricate geometric circuitry patterns, representing advanced automotive chip development.
Semiconductor firm T2M has expanded its automotive IP core portfolio with new connectivity and memory interfaces to streamline the development of vehicle electronics. AI Illustration. Upload story photo >

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T2M has updated its portfolio of silicon-proven IP cores designed for automotive applications. The expansion introduces a variety of interfaces to simplify the development of advanced automotive system-on-chips.

Why it matters

This move aims to help engineers reduce integration risks and shorten time-to-market for vehicle electronics. By centralizing these technologies, developers can source critical components through a single commercial interface.

The expanded portfolio features 100BASE-T1 PHY cores supporting 100 Mbps, while MIPI A-PHY IP reaches data rates up to 6.4 Gbps. Additionally, the company provides DDR and LPDDR combo cores at 4800 Mbps and high-speed SerDes IP ranging from 10G to 112G.

The players

T2M

T2M is an international provider of silicon-proven IP cores that maintains global operations across Germany, China, India, South Korea, and the United States.

The details

T2M now offers a broader selection of technologies including Automotive Ethernet, USB, and analog cores alongside its existing memory interfaces. Clients can access these assets through flexible licensing structures such as BlackBox or WhiteBox options, with additional support for IP customization and process-porting services.

Timeline

  1. T2M announced the expanded semiconductor IP portfolio on September 22, 2026.

The Tech Race

The expansion of this IP portfolio marks a pivotal shift in the supply chain for Automotive System-on-Chip (SoC) development. By providing standardized modules, T2M is positioning itself to replace fragmented legacy sourcing with a unified technical interface for next-gen vehicles.

For developers and automotive engineers, this development simplifies the sourcing of essential chip components by offering a single point of technical integration. This change can potentially reduce the complexity and costs associated with designing advanced vehicle communication systems.

The takeaway

As vehicles become more reliant on complex data processing, the use of modular IP cores has become essential for rapid innovation. Companies that streamline these integration processes will likely hold a competitive advantage in the high-stakes automotive tech sector.

Further reading

For more on the industry trends shaping chip design, explore our latest Semiconductors analysis.

Source note: This article includes information reported by Design-reuse.

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