Teledyne e2v Released Perciva ToF 3D Camera
The new industrial 3D imaging device utilizes specialized CMOS sensor technology for high-resolution data capture.
Updated on Sept. 19, 2026 in Semiconductors
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Teledyne e2v has introduced the Perciva ToF 3D camera, designed to provide high-resolution depth maps and point cloud data in demanding operational environments. The device integrates advanced sensor technology to improve performance at near-infrared wavelengths.
Why it matters
This camera is designed to maintain operational reliability in harsh industrial conditions while simplifying integration through embedded processing. By providing direct data output, it reduces the complexity typically associated with multi-camera interference management.
The Perciva ToF camera features an 832 x 600-pixel resolution and utilizes a 10 µm three-tap pixel architecture. It incorporates HiRho technology to enhance performance at near-infrared wavelengths and uses a GigE interface for data transmission.
The players
Teledyne e2v
Teledyne e2v is a global manufacturer of specialized imaging sensors and semiconductors for high-performance industrial and scientific applications.
The details
The device relies on the Hydra3D+ CMOS image sensor and factory calibration to generate usable depth maps and point clouds without requiring external processing or multiple interconnected cameras to mitigate signal interference. This hardware configuration enables the camera to operate effectively in complex industrial settings where consistent and precise 3D data is required.
Timeline
Teledyne e2v announced the release of the Perciva ToF camera on September 19, 2026.
The Tech Race
The release of the Perciva ToF camera marks an expansion of the Hydra3D+ CMOS image sensor ecosystem within industrial imaging. By integrating these sensors directly into calibration-ready hardware, the company is competing to replace complex multi-sensor systems with streamlined, high-resolution units.
Industrial engineers and systems integrators can now utilize a unified, pre-calibrated 3D camera to reduce setup time and software overhead. This hardware simplifies the process of integrating high-resolution 3D vision into automated workflows by removing the need for external interference management.
The takeaway
Advanced time-of-flight imaging is becoming more accessible for demanding industrial environments through increased hardware integration. Users should evaluate their specific resolution and bandwidth requirements to determine if this platform's embedded processing meets their operational needs.
Further reading
For more on industry hardware developments, visit the Semiconductors section.
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