ACCM Expands Materials Capacity in La Crosse
Advanced Chip and Circuit Materials is adding prepreg, build-up and laminate capacity for its Celeritas dielectric materials at its Wisconsin site.
Updated on Nov. 10, 2026 in Semiconductors
Advanced Chip and Circuit Materials is expanding manufacturing capacity in La Crosse, Wisconsin, for its Celeritas family of dielectric materials designed for AI hardware. The company is also opening a second materials characterisation laboratory at the facility.
Why it matters
The Celeritas materials are made without T-glass or quartz fabric, inputs that are in short supply across the printed circuit board industry. The expansion adds domestic capacity for a supply chain that serves AI hardware makers.
ACCM's announced capacity is 87 million square feet per year of prepreg and build-up materials by November 2026, with 20 million square feet per year of laminate added in January 2027. The company has not disclosed the investment size or how these volumes compare with demand.
The players
Advanced Chip and Circuit Materials (ACCM)
A US materials company that makes the Celeritas family of dielectric materials used in printed circuit boards for AI hardware.
The details
The materials are made on a raw material supply chain independent of the conventional copper-clad laminate chain and are halogen-free and PFAS-free. They can be processed on lamination, drilling and plating equipment that PCB makers already use, with typical lead times of three weeks.
Timeline
November 2026: prepreg and build-up capacity reaches 87 million square feet per year.
January 2027: new laminate capacity of 20 million square feet per year comes online.
Second half of 2027: larger expansions of prepreg, build-up and laminate capacity are planned.
The Tech Race
The Celeritas materials are positioned as an alternative to laminates that depend on T-glass and quartz fabric, both of which are in short supply for high-speed PCB production. The expansion places ACCM in competition with suppliers that rely on those conventional fabrics.
Manufacturers of AI hardware may gain a domestic option for dielectric materials with three-week lead times that run on existing PCB equipment. The effect on consumer device prices has not been addressed in the announcement.
The takeaway
Materials that avoid constrained fabrics like T-glass and quartz could ease bottlenecks in AI hardware production. Watch for the capacity milestones scheduled for late 2026 and 2027 to see whether supply keeps pace with demand.
What happens next
Prepreg and build-up capacity reaches 87 million square feet per year in November 2026, and new laminate capacity comes online in January 2027. Larger expansions are planned for the second half of 2027.
Further reading
For more on the chip supply chain behind this expansion, see Semiconductors.
Source note: This article includes information reported by Evertiq.
