Advantest Showcased Semiconductor Tools in San Antonio
The Tokyo-based company demonstrated its latest testing solutions at the 2026 International Test Conference.
Updated on Oct. 13, 2026 in Semiconductors
Advantest Corporation has arrived at the Grand Hyatt Regency Riverwalk to showcase its semiconductor testing portfolio. As a Platinum sponsor, the company is engaging with industry professionals through technical sessions and product demonstrations.
Why it matters
The company's presence at the conference highlights its continued role in advancing semiconductor test workflows and automation for 3D packaging technologies. These technical sessions provide a platform for engineers to discuss the future of test analytics and industry adoption.
Advantest is showcasing the SiConic ecosystem, System-Level Test platforms, and the V93000 EXA Scale SoC Test System. Its display also features the SmarTest 8 software and Velocity automation solution.
The players
Advantest Corporation
Headquartered in Tokyo, Japan, the company provides advanced test equipment for the semiconductor industry.
John Carulli
He is a representative for the company moderating sessions on test flow optimization and test analytics at the conference.
Davette Berry
She is a scheduled presenter at the 2026 International Test Conference.
The details
Company representatives are leading technical presentations, including John Carulli, who is moderating a session on test flow optimization for 3D advanced packaging. The firm is also participating in high-level discussions focused on the broad industry adoption of test analytics.
Timeline
The 2026 International Test Conference is taking place from Oct. 11-16, 2026.
Davette Berry is scheduled to present on Oct. 14, 2026, at 10:30 a.m.
The Tech Race
The introduction of advanced 3D packaging test solutions marks a significant shift as the industry moves beyond traditional planar chip testing. This evolution positions Advantest against other major equipment providers as companies race to ensure reliability in complex, multi-chip architectures.
Professional engineers attending the conference can interact directly with the latest automation and test software suites. These advancements in testing speed and accuracy ultimately help lower production costs and improve the reliability of consumer electronics.
The takeaway
The increased focus on test analytics and 3D packaging reflects the industry shift toward more integrated hardware development. Attendees should prioritize the technical sessions to understand how these automation tools will influence future semiconductor production timelines.
Further reading
For more on industry testing standards, visit the Semiconductors section.
More information
Find additional details on their hardware portfolio at Advantest corporate information and test solutions.
