Stackpole Released New Aluminum Nitride Chip Resistors
The Raleigh-based firm has introduced the RMAN series designed for high-power industrial and automotive electronics.
Updated on Oct. 12, 2026 in Semiconductors
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Stackpole Electronics has launched the RMAN series of aluminum nitride chip resistors. These components use an aluminum nitride substrate to improve heat dissipation in compact power applications.
Why it matters
As electronics become smaller and more powerful, managing heat has become a primary challenge for engineers. This series helps designers increase power density by reducing localized heating in industrial and automotive systems.
The RMAN series leverages aluminum nitride substrates, which offer higher thermal conductivity than traditional alumina. The 1206 size resistor delivers a 2.4 W power rating, while the 2512 model provides 3.4 W.
The players
Stackpole Electronics
A global manufacturer of electronic components with headquarters in Raleigh and facilities across Japan, Taiwan, China, the US, and Mexico.
The details
The RMAN series combines thick film technology with aluminum nitride to achieve superior thermal management. This design allows for higher power density in demanding industrial and automotive applications.
Timeline
Stackpole began manufacturing operations in 1928.
The Tech Race
The adoption of aluminum nitride replaces alumina-based substrate technology to address critical thermal constraints in modern circuit designs. This move positions the manufacturer to better serve the increasingly compact and power-intensive requirements of the global automotive and industrial sectors.
These resistors enable more compact and reliable electronic systems in vehicles and industrial machinery. By allowing for higher power density, they help engineers develop smaller devices that are less prone to heat-related failures.
The takeaway
Effective thermal management is the deciding factor in the reliability of modern high-power electronics. Engineers should consider upgrading to aluminum nitride components when designing hardware that requires both high power density and space efficiency.
Further reading
Learn more about the latest innovations in Semiconductors.
Source note: This article includes information reported by EEJournal.
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