ForwardEdge ASIC Launches New UCIe 3.0 IP Solution
The Saint Paul-based firm introduces a chiplet-based solution to address modern semiconductor design challenges.
Updated on Oct. 15, 2026 in Semiconductors
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ForwardEdge ASIC has released a new UCIe 3.0 IP solution designed to support interoperability across various process nodes and packaging technologies. The IP is now available for customer engagements and is fully proven on the GlobalFoundries 12LP+ node.
Why it matters
Traditional monolithic system-on-chip architectures have faced mounting difficulties regarding complexity, manufacturing costs, and yield limits. This solution provides a standards-based alternative to help developers reduce time-to-market risks.
The new IP maintains an 87% first-pass ASIC success rate and is validated on the GlobalFoundries 12LP+ node. It supports heterogeneous integration across diverse IP vendors and packaging technologies to ensure hardware interoperability.
The players
ForwardEdge ASIC
ForwardEdge ASIC is a semiconductor design firm headquartered in Saint Paul that specializes in advanced chip development and IP solutions.
GlobalFoundries
GlobalFoundries is a semiconductor foundry that manufactures complex integrated circuits for various industrial and consumer applications.
The details
By utilizing a 100% domestic supply chain, the product offers a secure path for companies looking to move away from monolithic design constraints. The architecture is engineered to streamline the integration of multiple components into single, efficient systems.
Timeline
ForwardEdge ASIC officially announced the UCIe 3.0 IP solution on October 15, 2026.
The Tech Race
The semiconductor industry is moving away from monolithic chips toward modular chiplet architectures to bypass physical scaling limits. ForwardEdge ASIC is positioning its new solution to compete in this race by leveraging the Universal Chiplet Interconnect Express standard.
This development may lead to more efficient and reliable consumer electronics by enabling faster hardware design cycles. The use of a domestic supply chain could also provide more predictable availability for future tech hardware.
The takeaway
The move toward standardized chiplet interfaces represents a critical shift in how complex processors are built to ensure long-term sustainability. Companies adopting these modular tools may find significant improvements in production yields and development flexibility.
Further reading
Learn more about local industry trends in our Saint Paul Semiconductors section.
Source note: This article includes information reported by Design-reuse.
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Do you believe the shift to chiplet-based technology will result in more affordable electronics for you?
