Advanced Chip Will Exhibit at 2026 PCB West

Advanced Chip & Circuit Materials will showcase its Celeritas product line at the Santa Clara Convention Center.

Updated on Sept. 25, 2026 in Semiconductors

Advanced Chip Will Exhibit at 2026 PCB West

Live Poll

Will new material technologies sustain the power and speed requirements of future AI computing systems?

Advanced Chip & Circuit Materials will exhibit its Celeritas electronic materials at the 2026 PCB West trade show on September 30, 2026. The company will showcase specialized products designed for high-performance computing applications.

Why it matters

The exhibition highlights the ongoing development of materials needed to support increasingly fast and complex electronic systems. These advancements are critical for maintaining signal integrity and thermal management in modern high-speed circuit boards.

Celeritas materials support operations up to 100+ GHz and 448 Gb/s, with specific high-speed digital circuit support reaching 112 GHz. The materials include HM001 and HM50 variants for power plane stabilization and SMC substrates for thermal expansion matching.

The players

Advanced Chip & Circuit Materials

This company specializes in the development and automated manufacturing of electronic materials for advanced semiconductor and circuit board applications.

The details

Advanced Chip & Circuit Materials will staff Booth 611 to demonstrate how its Celeritas line manages power and heat in heavy copper PCBs. The company utilizes automated manufacturing lines to produce these materials, which are designed to mirror the thermal expansion coefficients of silicon interposers.

September 30, 2026: Advanced Chip & Circuit Materials will be present at the exhibition.

Roadmap

The introduction of materials supporting 112 GHz and 448 Gb/s speeds marks a critical step in the industry's transition toward faster data processing capabilities. As hardware demands increase, the development of these specialized substrates remains central to competing against global material suppliers.

Engineers and product designers attending the event can evaluate how these materials might improve the efficiency and reliability of their next-generation hardware designs. The presence of these materials at the show provides a venue for assessing how specific substrates could resolve thermal warpage challenges.

The takeaway

Advancements in circuit substrate materials are essential to overcoming the physical limitations posed by high-speed digital systems. Professionals should focus on how these specialized components align with their specific thermal management and data throughput requirements.