Airsys and Shell Will Demonstrate Spray Cooling in San Jose
The companies will showcase a cassette-based spray cooling system during the upcoming 2026 OCP Global Summit.
Updated on Oct. 5, 2026 in Data Centers

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Airsys and Shell will demonstrate their new spray liquid cooling technology at a live community outreach event in San Jose on October 14, 2026. The system is designed to provide efficient heat removal for AI, telecom, and data center environments.
Why it matters
This technology bridges the gap between traditional air-cooling upgrades and complex, infrastructure-heavy immersion systems. By targeting heat directly on CPUs and GPUs, it offers a more sustainable path for high-density computing needs.
The spray cooling system uses 80% less dielectric fluid than standard immersion systems. Airsys brings 30 years of cooling design experience to the project, supported by a global workforce of over 1,000 employees across 16 locations.
The players
Airsys
Airsys is a specialized cooling solutions provider with headquarters in Woodruff, S.C. and 16 global locations.
Shell
Shell is a multinational energy company that provides the specialized dielectric liquid cooling fluid for the system.
The details
The system features a cassette-based architecture that allows for deployment in both new and existing server environments. During the demonstration, attendees will be able to view the server cooling process through a clear cassette enclosure.
Timeline
The 2026 OCP Global Summit runs in San Jose from October 12-15, 2026.
The live spray cooling demonstration occurs on October 14, 2026.
The demonstration event is scheduled from 7:30 - 10:30pm.
Roadmap
This innovation signals a broader shift in the data center industry toward mid-density liquid cooling solutions as AI hardware demands rise. By adopting a cassette-based approach, manufacturers are positioning these systems to compete with legacy infrastructure setups.
For data center operators, this technology offers a practical way to manage increasing heat loads from AI processors without requiring full-scale facility retrofits. Developers can expect easier integration into existing server racks, potentially lowering maintenance and fluid costs.
The takeaway
Spray cooling systems provide a modular alternative for firms struggling to manage the thermal density of modern AI hardware. Companies looking to modernize should evaluate if cassette-based architectures fit their current server density requirements.
Further reading
For more information on the evolving hardware landscape, visit our Data Centers section.
More information
To register for the live event, visit the event invitation request portal.
Source note: This article includes information reported by The Manila times.
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