xMEMS Launches Mass Production of Micro-Cooling Chips
The new XMC-2400 and XMC-4800 chips use piezo technology to provide active cooling for compact electronic devices.
Updated on Oct. 20, 2026 in Semiconductors
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xMEMS Labs has begun mass production of its XMC-2400 and XMC-4800 micro-cooling chips designed for heat management in dense hardware like smartphones and AI glasses. These components utilize a PiezoMEMS platform to move air through compact spaces while overcoming high back pressure.
Why it matters
Active cooling solutions are increasingly necessary as devices become thinner, yet conventional fans are often too noisy or bulky for modern electronics. These new chips provide a compact alternative that can be integrated directly onto circuit boards.
The XMC-2400 measures 7.42 mm x 9.48 mm x 1.13 mm and draws 150 mW, while the larger XMC-4800 measures 9.93 mm x 14.35 mm x 1.13 mm and draws 240 mW. Both components are IP58-rated and can achieve temperature reductions of 10°C to 25°C.
The players
xMEMS Labs
This semiconductor company specializes in the development of micro-electromechanical systems for various acoustic and thermal management applications.
The details
Engineers can reflow these chips onto rigid or flex PCBs using standard pick-and-place equipment, allowing for vertical airflow that can be reversed during operation. The technology is specifically engineered to function in tight spaces where high back pressure prevents traditional cooling methods from working efficiently.
Timeline
October 20, 2026: xMEMS Labs initiated mass production of the new micro-cooling chips.
Early 2027: The first commercial consumer products featuring the XMC-2400 are expected to hit the market.
The Tech Race
This development represents a departure from the reliance on conventional mechanical cooling fans, which are increasingly unsuitable for the ultra-thin form factors of modern mobile devices. By moving to solid-state airflow, manufacturers can better compete in the race to create thinner, more powerful electronics.
Users may soon see thinner smartphones and more capable AI wearables that maintain better thermal performance without the noise associated with mechanical fans. These chips allow designers to pack more power into smaller devices while potentially extending the longevity of sensitive internal components.
The takeaway
These solid-state cooling chips provide a vital solution for manufacturers struggling to manage the heat generated by increasingly powerful, miniature electronics. For future hardware design, the transition to integrated PiezoMEMS cooling will likely become a standard feature for high-performance mobile devices.
What happens next
Consumers can anticipate the arrival of the first commercial electronic devices incorporating these XMC-2400 chips in early 2027.
Further reading
Learn more about the latest innovations in the hardware sector on our Semiconductors page.
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