Teledyne Storm Launches MultiFlex Micro-D Platform
The new interconnect system provides high-density RF connectivity for compact aerospace and defense electronics.
Updated on Oct. 20, 2026 in Semiconductors
Live Poll
Should aerospace and defense manufacturers prioritize developing more compact, integrated technology for military and space systems?
Teledyne Storm Microwave has introduced the MultiFlex Micro-D platform, a new interconnect solution developed in partnership with Omnetics Connector Corporation. This system is designed to provide high-density, lightweight connectivity for space-constrained applications in the aerospace and defense sectors.
Why it matters
As aerospace and defense electronics become increasingly compact, there is a growing demand for robust connectivity that maintains high performance in smaller form factors. This platform helps engineers integrate essential RF channels and control wiring within tight hardware limits.
The MultiFlex Micro-D platform features a 1.2-inch housing and supports up to 8 RF channels with frequencies reaching 67 GHz. It is compatible with multiple interfaces including SMPM, SMA, 2.9 mm, 2.4 mm, and 1.85 mm standards.
The players
Teledyne Storm Microwave
This company specializes in the design and manufacture of high-performance microwave and RF cable assemblies for military and aerospace applications.
Omnetics Connector Corporation
This organization is a manufacturer of micro-miniature electronic connectors and interconnection systems used across various defense and industrial markets.
The details
The platform incorporates VITA 67.3 NanoRF-compliant contacts and utilizes Storm Flex 034 and 047 cable technology. By combining these cables with ruggedized Micro-D connectors, the design allows for hybrid assemblies that manage both RF and control wire connections simultaneously.
Timeline
October 20, 2026: Teledyne Storm Microwave unveiled the MultiFlex Micro-D platform.
The Tech Race
This development aligns with the broader industry transition toward the VITA 67.3 NanoRF standard, which facilitates high-density interconnects in modular open systems. It positions the companies against other providers of ruggedized components as they compete to reduce size and weight in mission-critical defense hardware.
Engineers and hardware designers working in defense sectors can now leverage these configurable assemblies to simplify the integration of RF and control lines in dense modules. This modularity reduces the complexity of wiring and structural layouts for next-generation electronic devices.
The takeaway
This launch highlights a continued shift toward miniaturization in mission-critical defense electronics. Professionals should evaluate how integrating multi-channel RF platforms can optimize space within existing or future hardware designs.
Further reading
For more on evolving component standards, browse the Semiconductors section.
Source note: This article includes information reported by Everythingrf.
Live Poll
Should aerospace and defense manufacturers prioritize developing more compact, integrated technology for military and space systems?
