Frore Systems Unveiled LiquidJet Diamond Coldplate
The new hardware uses diamond thermal technology to manage extreme power densities in AI accelerators.
Updated on Oct. 12, 2026 in Data Centers
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Frore Systems introduced the LiquidJet Diamond liquid-cooling coldplate, which is designed to handle high power densities in advanced AI accelerators. The product utilizes diamond wafers to significantly enhance thermal management for GPU hardware.
Why it matters
This technology directly addresses critical thermal hotspots in AI chips that can limit performance. By improving heat transfer, it enables higher efficiency and throughput for the intense power demands of modern computing.
The LiquidJet Diamond coldplate achieves a thermal conductivity of 20 W/cm·K using diamond wafers, compared to roughly 4 W/cm·K for traditional copper. This design supports hotspot power densities up to 770 W/cm² and improves AI token throughput by 30% to 35%.
The players
Frore Systems
This company develops thermal management technologies designed to solve heat-related performance bottlenecks in consumer and enterprise hardware.
OCP Global Summit
This annual industry event brings together hardware engineers and data center operators to discuss open-source hardware innovations.
The details
The system utilizes a multi-stage architecture with customized coolant channels to direct heat away from processor hotspots. Integrating diamond wafers above these high-intensity areas allows the device to surpass the limitations of conventional metal cooling solutions.
Timeline
October 12 - 16, 2026: Frore Systems will demonstrate the coldplate at the OCP Global Summit.
The Tech Race
The LiquidJet Diamond coldplate was engineered to support the thermal requirements of the Nvidia Rubin accelerator, marking a shift toward more advanced material science in data center cooling. This development positions the company as a key competitor against firms relying on traditional copper-based heat sinks.
Data center operators may see improved efficiency and higher AI throughput, potentially reducing the energy-per-token costs for end-users of AI services. These performance gains can extend the lifespan of high-power hardware by maintaining safer operating temperatures.
The takeaway
Using diamond wafers for thermal management represents a significant leap over copper-based cooling in extreme computing environments. As chip power densities rise, such material advancements will become essential for maintaining performance stability in AI server infrastructure.
Further reading
Learn more about the latest innovations in high-performance cooling at Data Centers.
Source note: This article includes information reported by Tom's Hardware.
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