AEWIN Technologies Revealed New Modular AI Servers
The company debuted DC-MHS systems and liquid cooling tech designed for high-density AI computing infrastructure.
Updated on Oct. 6, 2026 in Data Centers
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AEWIN Technologies showcased its new line of modular DC-MHS AI servers and two-phase direct liquid cooling solutions in San Jose. These systems leverage advanced thermal management to support intense computing workloads required for modern AI deployments.
Why it matters
Enterprises are facing significant thermal management challenges as the demand for high compute density and high-speed connectivity in AI infrastructure grows. Advanced liquid cooling and modular architectures provide the necessary support to scale these high-performance operations efficiently.
The new lineup includes the BG18-A10710 model, which fits 600W CPUs and dual 600W GPUs into a 1U form factor. Other configurations include the BG48-A20813, a 4U system supporting up to eight dual-width GPUs, and the BS28-A10710 featuring 16 E3.S drive bays.
The players
AEWIN Technologies
This company specializes in the development of industrial-grade networking and computing hardware solutions for server infrastructure.
AMD
This semiconductor manufacturer produces the high-performance EPYC processors used in the newly released server portfolio.
ASPEED Technology
This company provides baseboard management controller (BMC) chips that facilitate remote server monitoring and system management.
The details
The systems integrate ASPEED AST2700 BMC system management and utilize the AMD EPYC 9006 series CPUs to handle demanding processing tasks. AEWIN designed the two-phase direct liquid cooling solutions specifically to manage the extreme thermal loads generated by these dense rack-scale architectures.
Timeline
October 6, 2026: AEWIN showcased the new server and cooling technologies in San Jose.
October 12-15, 2026: AEWIN will exhibit these systems at the OCP Global Summit.
The Tech Race
The transition to the DC-MHS hardware specification marks a shift toward standardized, modular server design in the data center market. By adopting this framework, AEWIN positions its high-density cooling solutions as a critical component in the race to support next-generation AI processing power.
Data center operators and enterprise IT managers can expect these modular systems to simplify thermal management and increase rack density within existing facilities. By consolidating high-power GPUs into smaller form factors, companies may reduce the physical footprint required for large-scale AI training clusters.
The takeaway
Advancements in liquid cooling are becoming essential as hardware power requirements continue to climb for AI-driven data centers. Managing heat density effectively is no longer optional for firms attempting to scale their high-performance compute capabilities.
What happens next
AEWIN Technologies is scheduled to exhibit these cooling and server systems at the OCP Global Summit, which will take place from October 12 through October 15, 2026.
Further reading
Learn more about the infrastructure supporting high-performance computing in our Data Centers section.
More information
For detailed specifications, visit the AEWIN company information website.
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