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Intel Foundry Integrated High NA EUV Lithography

Intel Foundry has processed one million wafers using advanced High NA EUV lithography tools for chip manufacturing.

Updated on Sept. 22, 2026 in Semiconductors

Isometric editorial illustration of a silicon wafer inside a cleanroom manufacturing chamber, representing advanced semiconductor production.
Intel Foundry has reached a production milestone by processing one million wafers using its new High NA EUV lithography technology in the United States. AI Illustration. Upload story photo >

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Intel Foundry has successfully implemented high-volume production using High NA EUV lithography, processing over one million wafers. The company is currently utilizing this technology to manufacture select layers for its Intel Core Ultra Series 3 processors.

Why it matters

These manufacturing innovations are essential to support the production of increasingly complex AI-focused computing products. The adoption of this equipment enables advanced semiconductor scaling that traditional tools cannot achieve.

Intel is currently utilizing 6-inch mask formats for High NA production and has enabled usage through stitching capabilities. The firm is actively working toward a future target of 6x12-inch mask formats to improve scaling efficiency.

The players

Intel Foundry

This division operates as the manufacturing arm of Intel, focusing on advanced semiconductor fabrication services for internal and external clients.

ASML

ASML is a Netherlands-based technology company that serves as the world's primary supplier of lithography systems used in semiconductor manufacturing.

The details

Intel Foundry integrates this lithography by utilizing stitching capabilities that allow for floor-planning within standard 6-inch masks. This progress is the result of a collaborative initiative involving mask makers, EDA partners, and materials suppliers that has been underway for three years.

Timeline

  1. Intel began championing the large mask format initiative in 2021.

  2. Intel installed its first commercial EXE system in 2024.

  3. Intel and ASML presented their progress at the SPIE conference in September 2026.

The Tech Race

This transition marks a pivotal shift in semiconductor fabrication, moving away from standard EUV tools toward higher numerical aperture systems. By successfully scaling High NA, Intel is establishing a new standard for density and performance that forces competitors to accelerate their own roadmaps.

The adoption of this manufacturing technology directly enables the production of more powerful and efficient AI products within the Intel Core Ultra Series 3 line. Consumers can expect future devices to benefit from the performance density improvements achieved through these high-volume production methods.

The takeaway

The move to High NA EUV represents a necessary evolution to keep pace with the physical demands of modern AI processing power. This milestone indicates that high-precision lithography is moving from experimental phases into the core of mass-market chip production.

Further reading

For more information on the industry's manufacturing trends, visit Semiconductors.

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Do you believe rapid advancements in chip production will make electronics more affordable for your household?