Celestica Has Released New DS6005 Data Center Switch

The company introduced a high-capacity switch designed to meet the growing power and bandwidth demands of AI data center networks.

Updated on Oct. 12, 2026 in Data Centers

Celestica Has Released New DS6005 Data Center Switch

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Celestica has launched the DS6005, a new data center switch featuring 102.4Tbps of switching capacity. The system incorporates co-packaged optical engines to address network density and efficiency needs.

Why it matters

The switch is engineered to solve critical bottlenecks in AI data center infrastructure, specifically improving bandwidth density, latency, and power management. Its specialized design is intended to support the high-performance requirements of modern artificial intelligence networking.

The DS6005 utilizes the Broadcom Tomahawk 6-Davisson switch chip within a 1.5OU form factor. It supports liquid cooling and integrates optical engines directly onto the ASIC to manage external laser modules.

The players

Celestica

This Toronto-based electronics manufacturing services company provides hardware design and supply chain solutions for global technology markets.

Broadcom

This semiconductor and software company develops the specialized chip technology used to power the high-speed data switching capabilities in the DS6005.

The details

This system employs CPO-aware software management and field-replaceable laser modules to streamline maintenance. By placing optical engines on the switch ASIC, the device reduces the power and reach constraints typical of high-bandwidth network architectures.

Timeline

  1. Celestica officially introduced the DS6005 switch on October 12, 2026.

  2. The product will be showcased at the OCP Global Summit from October 12-15, 2026.

The Tech Race

The deployment of the DS6005 highlights the rapid industry transition toward co-packaged optics as a solution for bandwidth limitations. This shift positions Celestica as a key player in the competitive hardware market designed to replace traditional pluggable transceiver models.

The introduction of this high-density hardware offers network operators improved efficiency and lower power consumption for AI-driven workloads. These infrastructure upgrades are designed to support the underlying performance of services that rely on massive data throughput.

The takeaway

This launch reflects the ongoing industry effort to move optical components closer to the switch chip for better power efficiency. Operators looking to optimize their server clusters should evaluate how co-packaged optics architectures could influence their future network power budgets.

Further reading

For more information on hardware trends, visit Data Centers.

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Is now the right time to prioritize new hardware technologies to improve AI energy efficiency?