Bitzer Will Debut Helicom CS60 Data Center Compressor
The new compressor series will be introduced at the Chillventa exhibition in Germany on October 13, 2026.
Updated on Oct. 12, 2026 in Data Centers
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Bitzer will debut its new Helicom CS60 screw compressor series designed specifically for data center cooling requirements. The company plans to showcase the new hardware at the upcoming Chillventa exhibition on October 13, 2026.
Why it matters
The system was developed to provide critical cooling support for next-generation AI chips, which require higher supply temperatures of up to 45°C. By managing these thermal demands, the technology aims to improve cooling efficiency in high-density computing environments.
The Helicom CS60 series supports 800 VDC infrastructures and handles R1234ze(E), R513A, and R515B refrigerants. The units operate at a minimum load of 25% capacity, with standard limits reaching 30°C for evaporating and 70°C for condensing temperatures.
The players
Bitzer
This is a German manufacturing company that specializes in refrigeration and air-conditioning technology.
The details
Engineers utilized advanced CFD simulations to optimize the rotor profile and internal geometry for maximum efficiency. The system incorporates an IQ Module CM-SW-02 for precision sensor monitoring and features integrated oil connections that allow for the use of an oil pump to maintain stable lubrication.
Timeline
October 13, 2026: The Chillventa exhibition begins.
The Tech Race
The introduction of the Helicom CS60 reflects the broader industry shift toward hardware specifically engineered for high-heat AI workloads. This compressor replaces general-purpose cooling solutions by focusing on the thermal management of next-generation chip density.
Data center operators can expect improved thermal management capabilities that support more powerful AI computing tasks. This hardware enables greater flexibility in cooling infrastructure, potentially reducing the energy footprint of high-performance data facilities.
The takeaway
The development highlights how component manufacturers are shifting their focus to accommodate the intense heat signatures produced by modern AI chips. Proper thermal regulation remains the primary bottleneck for scaling high-density computing power globally.
What happens next
The Helicom CS60 series will be presented at the Chillventa exhibition starting on October 13, 2026.
Further reading
Find more industry developments in the Data Centers section.
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Does making data centers more efficient improve the nation's environmental impact?
