Researchers Optimized Photonic Chip Microdisk Lasers

A new 12-micrometer device achieved a 4.15 gigahertz modulation bandwidth at room temperature.

Updated on Oct. 5, 2026 in Semiconductors

Bold flat-color editorial illustration featuring a geometric grid of silicon photonic wafers, representing advances in chip-scale laser technology.
Researchers from HSE University and Qilu University of Technology optimized a 12-micrometer microdisk laser, achieving a 4.15 gigahertz modulation bandwidth for photonic computing. AI Illustration. Upload story photo >

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Scientists from HSE University and Qilu University of Technology have developed an optimized microdisk laser method for photonic chips. The study, published in the Journal of Lightwave Technology, demonstrated a maximum modulation bandwidth of 4.15 gigahertz using a 12-micrometer device.

Why it matters

This research aims to address the rapidly increasing data-transfer demands required by modern artificial intelligence systems. By improving laser performance, the method could allow for the integration of multiple computing circuits on a single photonic chip.

The study utilized a 12-micrometer microdisk laser featuring InAs/InGaAs quantum dots that functions at room temperature. Researchers recorded a maximum modulation bandwidth of 4.15 gigahertz using -3 dB as the measurement threshold.

The players

HSE University

This research institution is based in St. Petersburg, Russia, and contributed to the photonic chip study.

Qilu University of Technology

Located in Shandong, China, this university collaborated on the development of the microdisk laser.

The details

The research team compared the device response speed under both optical and electrical excitation to isolate the performance gains of the microdisk laser. These findings are expected to accelerate the development of next-generation photonic chips for future computing hardware.

Timeline

  1. October 5, 2026: Findings were published in the Journal of Lightwave Technology.

The Tech Race

This development pushes the boundaries of the integrated silicon photonic chip platform by enabling faster data transmission on standard substrates. It follows a pattern of iterative breakthroughs necessary to overcome the physical bottlenecks currently facing high-speed AI computing hardware.

Future consumer devices may benefit from this technology through more efficient AI processing and lower power consumption for high-speed data tasks. This research represents an early step toward smaller, faster, and more capable chips in upcoming hardware generations.

The takeaway

Advancements in microdisk laser efficiency are critical for maintaining the pace of development for AI-focused infrastructure. Integrating these components directly into chip designs is likely to be a primary focus for engineers looking to break current speed barriers.

Further reading

For more on the evolution of advanced hardware, see our latest coverage on Semiconductors.

Source note: This article includes information reported by The Peninsula.

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