Samtec Launched New Connector Portfolio for oHFM.c Standard
The electronics manufacturer introduced high-speed interconnects designed to support the oHFM.c open standard.
Updated on Sept. 29, 2026 in Semiconductors
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Samtec has released a new portfolio of connectors supporting the oHFM.c standard to provide a unified architecture for custom electronic form factors. The components utilize high-density channels to address specific pinout and engineering requirements.
Why it matters
The oHFM standard provides a standardized framework that simplifies complex hardware designs by offering ready-to-use building blocks. These components help reduce overall engineering time by streamlining the development of custom systems.
The new connectors feature a 0.635 mm channel pitch and are available in 5 mm or 10 mm stack heights. They are engineered to support data rates of 64 Gbps or 112 Gbps PAM4 using IPC Class 3-compliant solder column board termination.
The players
Samtec
Samtec is a global manufacturer of electronic interconnect solutions specializing in high-speed and high-density connector technology.
The details
The product line leverages the Edge Rate contact system, which features a smooth milled mating surface for increased durability and narrow edges to reduce crosstalk. These connectors integrate directly into the oHFM.c standard's architecture to provide reliable signal integrity in compact designs.
Timeline
Samtec officially announced the new product portfolio on September 29, 2026.
The Tech Race
This release advances the broader industry shift toward standardized, modular hardware architectures that replace fragmented, proprietary design rules. By aligning with the SGeT oHFM.c standard, Samtec positions its components as foundational elements for high-speed, compact electronics.
Hardware engineers and designers can now utilize these standardized components to accelerate the development and production of high-performance devices. This modular approach reduces the need for custom-engineered interconnects, potentially lowering design costs for end-user electronics.
The takeaway
The move toward standardized building blocks like oHFM.c reflects a broader industry trend of prioritizing interoperability over proprietary hardware development. Engineers can leverage these standardized connectors to simplify complex design paths and improve component durability.
Further reading
Learn more about the latest innovations in high-speed hardware design by exploring our Semiconductors section.
More information
Review the technical specifications and design documentation for these new components on the Samtec interconnect solutions for oHFM.c portal.
Source note: This article includes information reported by Microwave Journal.
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