Nordic Semiconductor Introduced nRF54LC10A Chip
The new system-on-chip is designed to power compact devices with low power consumption requirements.
Updated on Sept. 29, 2026 in Semiconductors
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Nordic Semiconductor has unveiled the nRF54LC10A, a new system-on-chip built on a 22 nm process. The device integrates a microcontroller and wireless radio into a single package to support various IoT protocols.
Why it matters
This device helps manufacturers address the growing demand for smaller, more efficient electronics that require limited board space and lower production costs. It combines essential computing power with low-leakage architecture to extend battery life in wireless products.
The chip measures 1.9 mm by 2.3 mm and features a 128 MHz Arm Cortex-M33 processor with 1 MB of non-volatile memory and 192 KB of RAM. It supports Bluetooth LE, Thread, Zigbee, and Matter while consuming as little as 0.5 µA in sleep mode.
The players
Nordic Semiconductor
This is a Norwegian fabless semiconductor company that specializes in wireless communication technology for the Internet of Things.
The details
The nRF54LC10A utilizes a low-leakage RAM design and a multiprotocol radio to optimize efficiency for compact applications. By consolidating the controller and radio components, the design minimizes the physical footprint required on a printed circuit board.
Timeline
Nordic Semiconductor introduced the nRF54LC10A chip on September 29, 2026.
The Tech Race
The integration of this chip into the broader semiconductor market signals a shift toward smaller, multi-protocol capable solutions for the Internet of Things. By adopting the Arm Cortex-M33 processor architecture, the design sets a new standard for high-efficiency computing in compact devices.
Device manufacturers can leverage this chip to develop more compact and power-efficient smart home products or wearable devices for consumers. Users may benefit from longer battery life and smaller physical form factors in their connected gadgets.
The takeaway
The move toward 22 nm manufacturing for lower-cost IoT chips illustrates how efficiency gains continue to shrink device sizes. Developers should monitor how the integration of Matter and other protocols on a single chip simplifies cross-platform smart home compatibility.
Further reading
Learn more about the latest innovations in the industry in our Semiconductors section.
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