XP Power Released New ASB320 Power Supply Series
The baseplate-cooled AC-DC units integrate support hardware to streamline power layouts for original equipment manufacturers.
Updated on Sept. 28, 2026 in Semiconductors
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XP Power has introduced the ASB320 series, a line of fully encapsulated power supplies designed to provide 320 W of output. The series aims to simplify circuit designs by integrating necessary hardware like EMC filters and fuses directly into the unit.
Why it matters
By incorporating bulk storage capacitors and filtering components, the design helps original equipment manufacturers save valuable board area. This integration simplifies the layout process for industrial and tech applications requiring high-density power solutions.
The ASB320 series features efficiency ratings between 92% and 94% at 230 VAC and offers seven voltage options from 12 VDC to 54 VDC. Each unit provides 3000 VAC input-to-output isolation and operates within a temperature range of -40°C to +90°C.
The players
XP Power
This company is a global manufacturer of power supply solutions for the electronics, industrial, and healthcare sectors.
DigiKey
This entity is a major global distributor of electronic components that stocks the new power supply series.
Mouser
This company serves as a worldwide distributor providing electronic parts and components to engineering professionals.
Avnet Abacus
This organization acts as a regional distributor of electronic components, specializing in interconnect, passive, and electromechanical products.
The details
These power supplies utilize baseplate conduction for heat dissipation and allow output voltage adjustments via an external resistor. The units are housed in a full-brick package that includes an AC fuse and a built-in EMC filter compliant with EN55032 Class B emissions standards.
Timeline
The ASB320 series power supplies became available for global purchase on September 28, 2026.
The Tech Race
This release reflects the broader industry move toward increasing power density in smaller, fully encapsulated form factors. The current design establishes a baseline that manufacturers expect to improve upon by utilizing advancements in switching topology and wide-bandgap semiconductor devices.
The ASB320 series simplifies assembly for engineers and system designers by reducing the number of external components required on a circuit board. This streamlined approach potentially shortens development cycles and reduces the overall footprint for devices requiring high-efficiency power.
The takeaway
Advancements in fully integrated power supplies reflect the ongoing demand for smaller, more efficient electronics. Engineers should consider how such modular designs can reduce board complexity while meeting stringent emissions and thermal requirements.
Further reading
For additional context on the latest industry developments, visit the Semiconductors section.
Source note: This article includes information reported by Eepower.
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