TSMC Named SK Hynix Partner of the Year
The memory manufacturer received the recognition for its collaborative work on high-bandwidth memory integration.
Updated on Sept. 28, 2026 in Semiconductors
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TSMC has honored SK Hynix as its Partner of the Year in the 3DFabric-HBM Integration category for the second consecutive year. The companies collaborated on integrating HBM5 memory with TSMC's CoWoS advanced packaging technology.
Why it matters
As AI accelerators demand higher data processing speeds and memory density, the integration of HBM stacks via advanced packaging has become a critical bottleneck for hardware performance.
The partnership highlights validation of HBM5 alongside 12-layer HBM4 memory units featuring 36GB capacities. Additionally, SK Hynix displayed 96GB SOCAMM2 modules and projected the PCIe-based eSSD market to reach 1,933 exabytes by 2030.
The players
TSMC
TSMC is a leading global semiconductor foundry that specializes in advanced packaging technologies like CoWoS.
SK Hynix
SK Hynix is a major international memory semiconductor supplier and a leader in high-bandwidth memory production.
The details
At the TSMC Open Innovation Platform Conference, SK Hynix showcased next-generation AI memory products, including the PEB210 E1.S eSSD with liquid cooling. The collaboration utilizes chiplet technology to divide large chips into smaller functional components connected within a single package.
Timeline
SK Hynix began shipping 6th-generation HBM4 in the second quarter of 2026.
The TSMC Open Innovation Platform Conference took place on September 23, 2026.
The PCIe-based eSSD market volume is projected to reach 1,933 exabytes by 2030.
The Tech Race
The industry's transition toward chiplet-based architectures relies heavily on advanced packaging standards like CoWoS to manage heat and bandwidth. This collaboration solidifies the symbiotic relationship between specialized memory providers and foundries in the AI infrastructure race.
These technical advancements in AI memory density directly enable faster data processing for consumer and enterprise AI applications. Users can expect improved performance and efficiency in AI-powered software tools as these higher-capacity memory units reach the market.
The takeaway
The sustained collaboration between SK Hynix and TSMC demonstrates that memory performance is now as critical as processor speed in the AI hardware chain. Investors and users should look for continued memory density increases as the standard for future high-performance computing systems.
Further reading
For more on industry shifts in high-end chip manufacturing, see our latest coverage on Semiconductors.
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