SMART Photonics And GlobalFoundries Partnered On Foundry

The companies have launched a joint service to integrate silicon platforms with indium phosphide photonic circuits.

Updated on Sept. 27, 2026 in Semiconductors

Isometric editorial illustration featuring a hexagonal silicon wafer with a central crystalline structure, representing advanced photonics manufacturing technology.
SMART Photonics and GlobalFoundries have launched a joint foundry service to integrate indium phosphide circuits with silicon platforms for advanced optical manufacturing. AI Illustration. Upload story photo >

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SMART Photonics and GlobalFoundries have announced an open access foundry service designed to integrate silicon platforms with indium phosphide photonic integrated circuits. This collaborative effort incorporates lasers and modulators to support advanced optical manufacturing.

Why it matters

The partnership aims to resolve complex scaling challenges faced by AI data centers by providing an efficient production pathway for pluggable optical transceivers. This integration helps streamline the manufacturing of high-performance photonic components.

The joint service utilizes flip-chip technology to embed lasers and amplifiers within silicon-based cavities. Development focused on precise dimensional fitting and optical coupling requirements.

The players

SMART Photonics

Headquartered in Eindhoven, the Netherlands, this firm specializes in the development and production of indium phosphide photonic integrated circuits.

GlobalFoundries

This semiconductor manufacturer operates a global network of fabrication facilities across the United States, Europe, and Singapore.

The details

Engineers from both firms spent over a year co-developing the integration process to ensure high-performance coupling between distinct material platforms. By merging indium phosphide functionality with silicon-based manufacturing, the companies intend to improve the scalability of optical hardware.

Timeline

  1. SMART Photonics was established in 2012.

  2. Companies performed co-engineering from September 2025 through September 2026.

  3. General availability for the joint service is scheduled for the second half of 2027.

The Tech Race

This partnership reflects a broader industry movement to integrate photonics into silicon-based manufacturing to overcome bandwidth limitations in high-performance computing. It marks a departure from traditional discrete assembly toward a more cohesive, integrated production model for next-generation data centers.

This collaboration will eventually lead to more efficient hardware within AI data centers, potentially improving the reliability of cloud-based services for end users. Developers may see improved access to advanced photonic integration, shortening the time to market for optical products.

The takeaway

The move demonstrates how cross-industry cooperation is becoming essential for scaling the hardware needed to support artificial intelligence. Businesses and engineers should watch for the 2027 rollout as a potential benchmark for integrated silicon-photonics production costs.

What happens next

General availability for the joint foundry service is expected to begin in the second half of 2027.

Further reading

Learn more about the latest innovations in the Semiconductors sector.

Source note: This article includes information reported by Semiconductor Today.

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